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    Heat-activated pump with integrated evaporator for electronic chip heat removal
    1.
    发明授权
    Heat-activated pump with integrated evaporator for electronic chip heat removal 有权

    公开(公告)号：US12133363B1

    公开(公告)日：2024-10-29

    申请号：US18210626

    申请日：2023-06-15

    Applicant: HAMFOP Technologies LLC

    Inventor： Mudasir Ahmad

    IPC: H05K7/20 ,  F04B19/24 ,  F04F1/04 ,  F28D15/02 ,  H01L23/427

    CPC classification number: H05K7/20327 ,  F04B19/24 ,  F04F1/04 ,  F28D15/0266 ,  H01L23/427 ,  H05K7/20309 ,  H05K7/20827 ,  H05K7/20818

    Abstract: A heat-activated pump removes waste heat from an electronic chip. An evaporator integrated into the chip packaging receives heat from the chip, converting a working fluid into vapor. Piping from the evaporator to a heat exchanger and back form a fluid circulation system. A pressure-control valve set for a specified electronic operating temperature allows vaporized working fluid to vent into a liquid-piston chamber, where it expands adiabatically, displacing pumped liquid in a pumping stage and expelling it from the chamber through a unidirectional valve to the shared heat exchanger(s). The heat exchanger(s) has a heatsink transferring heat away to a flow of cooler fluid. The pumped liquid returns in a suction cycle to the chamber through another unidirectional valve. An injector valve returns jets of condensed working fluid to the evaporator in successive brief spurts responsive to periodic pressure pulses in the chamber.

    HEAT PIPE
    2.
    发明公开
    HEAT PIPE 审中-公开

    公开(公告)号：US20240191949A1

    公开(公告)日：2024-06-13

    申请号：US18443289

    申请日：2024-02-15

    Applicant: VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD.

    Inventor： XUE-MEI WANG

    IPC: F28D15/04 ,  F28D15/02

    CPC classification number: F28D15/046 ,  F28D15/0233 ,  F28D15/0266

    Abstract: A heat pipe has a tube and an evaporator wick. The tube has multiple groove structures, an evaporator section, and a condenser section. The groove structures are disposed on an inner surface of the tube and extend to two opposite ends of the tube to reduce flow resistance of liquid phase working fluid. The evaporator wick is disposed in the evaporator section. The evaporator wick is made of metal powder and sintered to adhere to the groove structures. The evaporator wick is uniform in thickness and uniformly adheres to the groove structures. The evaporator wick vaporizes the working fluid in the evaporator section. As a result, the heat pipe has good manufacturing process repeatability and is reliable, easy to manufacture, and low-cost.

    Wick structure of heat pipe
    4.
    发明授权
    Wick structure of heat pipe 有权

    公开(公告)号：US11940223B2

    公开(公告)日：2024-03-26

    申请号：US17223215

    申请日：2021-04-06

    Applicant: KOREA ATOMIC ENERGY RESEARCH INSTITUTE

    Inventor： Chan Soo Kim ,  Byung Ha Park ,  Yong Wan Kim ,  Sung-Deok Hong ,  Minhwan Kim

    IPC: F28D15/04 ,  F28D15/02 ,  F28F13/00

    CPC classification number: F28D15/046 ,  F28D15/0241 ,  F28D15/0266 ,  F28F13/003 ,  F28F2255/18

    Abstract: According to an embodiment, a wick structure of a heat pipe that is capable of bending while increasing a heat transferring operation limit value is provided by improving the wick structure provided inside the heat pipe. The wick structure of the heat pipe includes a plurality of wicks provided inside a heat pipe, wherein the plurality of wicks include: a first wick provided at one side of a length direction to correspond to a condenser section of a heat pipe; a second wick having one side elongated to be connected to the first wick and provided at an adiabatic section of the heat pipe; and a third wick having one side connected to the other side of the second wick to correspond to an evaporator section of the heat pipe and provided at the other side in the length direction, and the first wick, the second wick and the third wick have effective pore radiuses and pore structures that are different from each other and maintain a movement and a capillary force of an working fluid supplied to the inside of the heat pipe when bending the heat pipe.

    HEAT SINK WITH OPPOSED ELEMENTS PROVIDING TEMPERATURE GRADIENT
    6.
    发明公开
    HEAT SINK WITH OPPOSED ELEMENTS PROVIDING TEMPERATURE GRADIENT 审中-公开

    公开(公告)号：US20240068756A1

    公开(公告)日：2024-02-29

    申请号：US17899590

    申请日：2022-08-30

    Applicant: UNITED ARAB EMIRATES UNIVERSITY

    Inventor： SALAH ADDIN BURHAN AL OMARI

    IPC: F28D15/02 ,  F28D15/04 ,  F28D20/02

    CPC classification number: F28D15/0275 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/043 ,  F28D20/025

    Abstract: The heat sink with opposed elements providing a temperature gradient has first and second thermally conductive elements disposed diametrically opposite each other on opposite sides of a chamber filled with a thermally conductive phase change material (PCM). The first and second thermally conductive elements ascend vertically from a thermoconductive base of the PCM chamber, which is adapted for mounting on the case of a heat source, such as an electronic component that generates heat or has heat applied thereto from its surroundings during operation. The first thermally conductive element is maintained hotter than the second thermally conductive element to provide a temperature gradient across the PCM chamber. The PCM melts as heat is absorbed. Convection currents are induced in the melting PCM that enhance heat absorption from the heat source while maintaining the heat sink at a relatively low temperature by dissipation of heat through the second thermally conductive element.

    Heat conduction device with inner loop
    9.
    发明授权
    Heat conduction device with inner loop 有权

    公开(公告)号：US11788796B2

    公开(公告)日：2023-10-17

    申请号：US17398894

    申请日：2021-08-10

    Applicant: NIDEC CHAUN-CHOUNG TECHNOLOGY CORPORATION

    Inventor： Wen-Hsiung Jiang ,  Chun-An Shen ,  Chien-Cheng Huang

    IPC: F28D15/02 ,  F28F1/12

    CPC classification number: F28D15/0266 ,  F28F1/12 ,  F28F2255/18

    Abstract: A heat conduction device with an inner loop includes a vapor chamber having at least one hole edge and a heat pipe having an outer pipe and an inner pipe. The outer pipe has a closed end and an open end communicating with the hole edge. Two ends of the inner pipe are open. The inner pipe has one end communicating with the vapor chamber through the hole edge and the other end extended along the axial direction of the outer pipe to form at least one port for communicating the closed end of the outer pipe with the inner pipe. The inner pipe is located inside the outer pipe to form a gap annularly. The port communicates with the gap, so that the inner loop is formed between the vapor chamber and the heat pipe.

    Loop heat pipe with recessed top or bottom surface
    10.
    发明授权
    Loop heat pipe with recessed top or bottom surface 有权

    公开(公告)号：US11774181B2

    公开(公告)日：2023-10-03

    申请号：US17038415

    申请日：2020-09-30

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Yoshihiro Machida

    IPC: F28D15/00 ,  F28D15/02 ,  F28D15/04

    CPC classification number: F28D15/0266 ,  F28D15/046

    Abstract: A loop heat pipe includes: an evaporator; a condenser; a liquid pipe that connects the evaporator and the condenser; a vapor pipe that connects the evaporator and the condenser to form a loop flow path; and a porous body provided inside of a part of the evaporator, the condenser, the liquid pipe, and the vapor pipe. The evaporator, the condenser, the liquid pipe, and the vapor pipe have a first main surface. At least one recessed portion is formed in at least part of a first area, located directly above or below the flow path, of the first main surface, and is not formed in a second area, located directly above or directly below a pipe wall of the flow path, of the first main surface and is not formed in a third area, located directly above or below the porous body, of the first main surface.

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