公开(公告)号：US11838700B2

公开(公告)日：2023-12-05

申请号：US17833204

申请日：2022-06-06

Applicant: COMMSCOPE TECHNOLOGIES LLC

Inventor： Gordon John White ,  Shawn Phillip Tobey ,  Brian J. Fitzpatrick

IPC: H04Q1/02 ,  H01R13/42 ,  H01R13/518 ,  H01R13/10

CPC classification number: H04Q1/13 ,  H01R13/42 ,  H01R13/518 ,  H01R13/10

Abstract: A telecommunications patch panel system (10) including a plurality of multiport telecommunications bezel assemblies (200) installed within a panel frame (100) is presented. The bezel assemblies (200) are formed from cooperating first and second frame parts (210, 240) to define a plurality of jack receptacle openings (202). In one example, the plurality of jack receptacles (202) are arranged in a two-row array. The first and second frame parts (210, 240) also retain a central bonding strip (290) having a plurality of grounding contact elements (292, 293). The grounding contact elements (292, 293) ground the jack modules (120) that are installed within the bezel assembly jack receptacle openings (202). Where a two-row array of jack receptacle openings (202) is provided, the central bonding strip (290) can be configured to extend between the rows. The central bonding strip (290) can provide grounding for multiple bezel assemblies (200).