公开(公告)号：US20130075065A1

公开(公告)日：2013-03-28

申请号：US13243779

申请日：2011-09-23

申请人： Brett W. DEGNER ,  Jay S. Nigen ,  Jesse T. Dybenko

发明人： Brett W. DEGNER ,  Jay S. Nigen ,  Jesse T. Dybenko

IPC分类号： F28F13/00

CPC分类号： F04D25/0613 ,  F04D17/16 ,  F04D29/4226 ,  F04D29/4266 ,  F04D29/441 ,  F04D29/445 ,  F04D29/582 ,  G06F1/203 ,  Y10T29/49329 ,  Y10T29/5191

摘要： The described embodiments relate generally to optimizing airflow in a computer system. By modifying the external surface of centrifugal cooling fan enclosures the pressure drop associated with airflow moving around the enclosures can be reduced. This is generally accomplished by rounding off hard edges from the outside of the cooling fan enclosure as well as forming cover surfaces rather than simply using flat cover surfaces. In some cases this can also involve modifying the shape of the fan inlet, or even contouring the shape of the cooling fan blades to allow air to flow more easily through the computer enclosure.

摘要翻译： 所描述的实施例一般涉及优化计算机系统中的气流。 通过改变离心冷却风扇外壳的外表面，可以减少与围绕外壳移动的气流相关联的压降。 这通常通过从冷却风扇外壳的外部四舍五入硬边缘以及形成盖表面而不是简单地使用平的盖表面来实现。 在某些情况下，这也可能涉及修改风扇入口的形状，或者甚至使冷却风扇叶片的形状成形，以使空气更容易流过计算机外壳。