公开(公告)号：US20150372215A1

公开(公告)日：2015-12-24

申请号：US14763147

申请日：2014-01-23

Applicant: DENSO CORPORATION

Inventor： Eijirou MIYAGAWA ,  Keita SAITOU ,  Yoshihiko SHIRAISHI ,  Yoshitaro YAZAKI ,  Toshihisa TANIGUCHI ,  Atusi SAKAIDA

IPC: H01L35/32 ,  H01L35/34

CPC classification number: H01L35/32 ,  H01L35/08 ,  H01L35/34

Abstract: An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate, and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.

Abstract translation: 制备绝缘基板。 在该基板中，在导电性糊料中填充有沿厚度方向贯通的多个通孔。 通过将有机溶剂加入到粉末中并通过将合金的功率加工成糊料来生产该糊料。 然后在被加热的同时从衬底的前表面和后表面压制衬底。 导电膏是固相烧结的，层间连接件形成。 前表面保护部件设置在基板的前表面上，背面保护部件设置在基板的背面，形成有层压体。 与在形成层间连接构件的过程中的温度和压力相比，在较低温度下加热时施加较低压力的层压体。