公开(公告)号：US20160121847A1

公开(公告)日：2016-05-05

申请号：US14896005

申请日：2014-05-23

Applicant: DENSO CORPORATION

Inventor： Keita SAITOU ,  Yoshihiko SHIRAISHI ,  Yoshitaro YAZAKI ,  Yasuhiro TANAKA ,  Eijirou MIYAGAWA ,  Motoki SHIMIZU ,  Toshikazu HARADA ,  Atusi SAKAIDA ,  Toshihisa TANIGUCHI ,  Norio GOUKO

IPC: B60R22/48 ,  G01K17/00 ,  G01V9/00

CPC classification number: B60R22/48 ,  B60N2/002 ,  B60R21/01512 ,  B60R2022/4808 ,  G01K17/00 ,  G01K17/20 ,  G01K2205/00 ,  G01V9/005

Abstract: A heat flux sensor is installed in such a way that heat flux emanating from a biological object present at a predetermined position is detectable. It is determined whether or not a biological object is present at the predetermined position by comparing sensing results of the heat flux sensor with determination criteria. The determination criteria is preset according to heat flux that can be sensed when a biological object is present at the predetermined position. When the sensing results of the heat flux sensor satisfy the determination criteria, in other words, when the heat flux sensed by the heat flux sensor is the heat flux emanating from a biological object, it is determined that a biological object is present at the predetermined position. Consequently, it is possible to realize accurate detection of a biological object.

Abstract translation: 热通量传感器以这样的方式安装，即可以检测出存在于预定位置处的生物物质发出的热通量。 通过将热通量传感器的感测结果与确定标准进行比较来确定生物体是否存在于预定位置。 确定标准根据当生物体存在于预定位置时可以感测到的热通量来预设。 当热通量传感器的感测结果满足确定标准时，换句话说，当由热通量传感器感测的热通量是从生物体发出的热通量时，确定生物体存在于预定的 位置。 因此，可以实现生物体的精确检测。

公开(公告)号：US20150372215A1

公开(公告)日：2015-12-24

申请号：US14763147

申请日：2014-01-23

Applicant: DENSO CORPORATION

Inventor： Eijirou MIYAGAWA ,  Keita SAITOU ,  Yoshihiko SHIRAISHI ,  Yoshitaro YAZAKI ,  Toshihisa TANIGUCHI ,  Atusi SAKAIDA

IPC: H01L35/32 ,  H01L35/34

CPC classification number: H01L35/32 ,  H01L35/08 ,  H01L35/34

Abstract: An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate, and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.

Abstract translation: 制备绝缘基板。 在该基板中，在导电性糊料中填充有沿厚度方向贯通的多个通孔。 通过将有机溶剂加入到粉末中并通过将合金的功率加工成糊料来生产该糊料。 然后在被加热的同时从衬底的前表面和后表面压制衬底。 导电膏是固相烧结的，层间连接件形成。 前表面保护部件设置在基板的前表面上，背面保护部件设置在基板的背面，形成有层压体。 与在形成层间连接构件的过程中的温度和压力相比，在较低温度下加热时施加较低压力的层压体。

公开(公告)号：US20170213953A1

公开(公告)日：2017-07-27

申请号：US15465035

申请日：2017-03-21

Applicant: DENSO CORPORATION

Inventor： Toshihisa TANIGUCHI ,  Yoshihiko SHIRAISHI ,  Atusi SAKAIDA ,  Keiji OKAMOTO ,  Eijirou MIYAGAWA

IPC: H01L35/32 ,  H01L35/34 ,  H01L35/10

CPC classification number: H01L35/32 ,  H01L23/38 ,  H01L35/04 ,  H01L35/10 ,  H01L35/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: As the first conductive paste, a paste is used which is made by adding an organic solvent to powder of alloy in which a plurality of atoms keep a given crystal structure constant. As the second conductive paste, a paste is used which is made by adding an organic solvent to powder of metal different in kind from the alloy. In a step of making the stack body, cavities are formed in the stack body. In a uniting step, the cavities work to facilitate flow of thermoplastic resin to absorb pressure acting in a direction different from a direction in which pressure exerted on the first conductive paste to unite the stack body, thereby resulting in an increase in pressure for the uniting to solid-state sinter the first conductive paste to make the first layer-to-layer connecting member.

公开(公告)号：US20170012196A1

公开(公告)日：2017-01-12

申请号：US15272713

申请日：2016-09-22

Applicant: DENSO CORPORATION

Inventor： Eijirou MIYAGAWA ,  Keita SAITOU ,  Yoshihiko SHIRAISHI ,  Yoshitaro YAZAKI ,  Toshihisa TANIGUCHI ,  Atusi SAKAIDA

IPC: H01L35/32 ,  H01L35/34

CPC classification number: H01L35/32 ,  H01L35/08 ,  H01L35/34

Abstract: An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an alloy, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.

Abstract translation: 制备绝缘基板。 在该基板中，在导电性糊料中填充有沿厚度方向贯通的多个通孔。 通过向合金粉末中加入有机溶剂，并通过将合金的功率加工成糊料来制造该糊料。 然后在被加热的同时从衬底的前表面和后表面压制衬底。 导电膏是固相烧结的，层间连接件形成。 前表面保护部件设置在基板的前表面上，背面保护部件设置在基板的背面，形成有层叠体。 与在形成层间连接构件的过程中的温度和压力相比，在较低温度下加热时施加较低压力的层压体。

公开(公告)号：US20170320463A1

公开(公告)日：2017-11-09

申请号：US15657358

申请日：2017-07-24

Applicant: DENSO CORPORATION

Inventor： Keita SAITOU ,  Yoshihiko SHIRAISHI ,  Yoshitaro YAZAKI ,  Yasuhiro TANAKA ,  Eijirou MIYAGAWA ,  Motoki SHIMIZU ,  Toshikazu HARADA ,  Atusi SAKAIDA ,  Toshihisa TANIGUCHI ,  Norio GOUKO

IPC: B60R22/48 ,  G01K17/00 ,  G01K17/20 ,  B60R21/015 ,  G01V9/00 ,  B60N2/00

CPC classification number: B60R22/48 ,  B60N2/002 ,  B60R21/01512 ,  B60R2022/4808 ,  G01K17/00 ,  G01K17/20 ,  G01K2205/00 ,  G01V9/005

Abstract: A heat flux sensor is installed in such a way that heat flux emanating from a biological object present at a predetermined position is detectable. It is determined whether or not a biological object is present at the predetermined position by comparing sensing results of the heat flux sensor with determination criteria. The determination criteria is preset according to heat flux that can be sensed when a biological object is present at the predetermined position. When the sensing results of the heat flux sensor satisfy the determination criteria, in other words, when the heat flux sensed by the heat flux sensor is the heat flux emanating from a biological object, it is determined that a biological object is present at the predetermined position. Consequently, it is possible to realize accurate detection of a biological object.

公开(公告)号：US20160141733A1

公开(公告)日：2016-05-19

申请号：US14895840

申请日：2014-04-30

Applicant: DENSO CORPORATION

Inventor： Yoshihiko SHIRAISHI ,  Atusi SAKAIDA ,  Toshihisa TANIGUCHI ,  Norio GOUKO ,  Yoshitaro YAZAKI ,  Motoki SHIMIZU ,  Eijirou MIYAGAWA ,  Yasuhiro TANAKA ,  Toshikazu HARADA ,  Keita SAITOU

IPC: H01M10/63 ,  H02J7/00 ,  H01M10/625 ,  H01M10/0525 ,  G01K17/00 ,  H01M10/44

CPC classification number: H01M10/63 ,  G01K17/00 ,  G01K17/20 ,  H01M10/0525 ,  H01M10/443 ,  H01M10/625 ,  H01M2220/20 ,  H02J7/007

Abstract: A heat quantity control device has a heat flux sensor arranged between first and second heating elements arranged adjacently to each other, and a control section for controlling a heat quantity of the first and second heating elements. The heat flux sensor has an insulation board made of thermoplastic resin, first and second via holes formed in the insulation board penetrating in a thickness direction thereof. First and second layer connection members are embedded in the first and second via holes, respectively. The first and second layer connection members are made of different metals and alternately connected in series. The control section controls a heat quantity generated in the first and second heating elements based on the electromotive force generated in the heat flux sensors so that a heat flux flowing between the first and second heating elements becomes not more than a predetermined value.

Abstract translation: 热量控制装置具有布置在彼此相邻布置的第一和第二加热元件之间的热通量传感器和用于控制第一和第二加热元件的热​​量的控制部分。 热通量传感器具有由热塑性树脂制成的绝缘板，形成在绝缘板上的第一和第二通孔沿其厚度方向贯穿。 第一和第二层连接构件分别嵌入第一和第二通孔中。 第一层和第二层连接构件由不同的金属制成并交替地串联连接。 控制部基于在热通量传感器中产生的电动势来控制在第一和第二加热元件中产生的热量，使得在第一和第二加热元件之间流动的热通量不超过预定值。