公开(公告)号：US20200307010A1

公开(公告)日：2020-10-01

申请号：US16807915

申请日：2020-03-03

Applicant: DISCO CORPORATION

Inventor： Takafumi OMORI ,  Shigenori HARADA ,  Takashi OKAMURA

IPC: B26D5/00 ,  B26D1/04 ,  B26D3/06

Abstract: A processing apparatus includes a cutting blade mounted on a spindle, the cutting blade having a cutting edge for cutting a workpiece held on a holding table, a measuring portion for measuring an edge projection amount of the cutting edge at a predetermined frequency, and a data processing portion. The data processing portion includes a lower limit recording portion for recording a lower limit of the edge projection amount of the cutting edge as an allowable limit for use of the cutting blade, a storing portion for storing blade information including the edge projection amount measured by the measuring portion and a cutting distance traveled by the cutting blade at the time of measurement of the edge projection amount.