公开(公告)号：US20140014976A1

公开(公告)日：2014-01-16

申请号：US13937976

申请日：2013-07-09

Applicant: Disco Corporation

Inventor： Takashi OKAMURA ,  Taro ARAKAWA

IPC: H01L33/20

CPC classification number: H01L33/20 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/172 ,  B23K2103/50 ,  H01L33/0095

Abstract: An optical device including: a rectangular front side having a light-emitting layer; a rectangular rear side parallel to the front side; and first to fourth lateral sides adapted to connect the front and rear sides, in which the first lateral side is inclined by a first angle with respect to a perpendicular of the front side, and the second lateral side opposed to the first lateral side is inclined by a second angle with respect to the perpendicular, and the third lateral side is inclined by a third angle with respect to the perpendicular, and the fourth lateral side opposed to the third lateral side is inclined by a fourth angle with respect to the perpendicular.

Abstract translation: 一种光学装置，包括：具有发光层的矩形前侧; 平行于前侧的矩形后侧; 以及第一至第四侧面，其适于连接前侧和后侧，其中第一侧面相对于前侧的垂直线倾斜第一角度，并且与第一侧面相对的第二侧向侧倾斜 相对于垂直方向具有第二角度，并且第三侧面相对于垂直方向倾斜第三角度，并且与第三侧面相对的第四侧面相对于垂直方向倾斜第四角度。

公开(公告)号：US20230321760A1

公开(公告)日：2023-10-12

申请号：US18193783

申请日：2023-03-31

Applicant: DISCO CORPORATION

Inventor： Takashi OKAMURA

IPC: B23K26/38 ,  B23K26/08 ,  B23K26/00 ,  B23K26/03

CPC classification number: B23K26/38 ,  B23K26/0823 ,  B23K26/0093 ,  B23K26/032 ,  B23K26/083 ,  B23K2101/40

Abstract: A processing apparatus that processes a workpiece includes a chuck table that holds the workpiece including multiple streets that intersect each other on a holding surface, a processing unit that processes the workpiece held by the chuck table along a corresponding one of the streets, and a controller. When processing is suspended with an unprocessed region left while the processing unit is caused to process the workpiece from one end to the other end of the street, the controller rotates the chuck table by 180 degrees and causes the processing unit to process the unprocessed region of the workpiece from the other end of the street.

公开(公告)号：US20210346990A1

公开(公告)日：2021-11-11

申请号：US17233657

申请日：2021-04-19

Applicant: DISCO CORPORATION

Inventor： Jinyan ZHAO ,  Shigenori HARADA ,  Takashi OKAMURA

IPC: B23K26/36 ,  B23K26/18 ,  B23K26/146 ,  B23K26/08 ,  B23K26/142

Abstract: A workpiece processing method includes a protective film forming step of coating an upper surface of a wafer with a protective film including a water-soluble resin, a laser processing step of applying a laser beam of such a wavelength as to be absorbed in the wafer to the upper surface to subject the wafer to ablation, and a cleaning step of removing the protective film from the upper surface of the wafer together with debris generated in the laser processing step. The cleaning step includes a first cleaning sub-step of spinning a spinner table holding the wafer and supplying a cleaning fluid to the upper surface of the wafer and a second cleaning sub-step of supplying a mixed fluid of gas and the cleaning fluid to the upper surface of the wafer held by the spinning spinner table, to clean the wafer.

公开(公告)号：US20220184768A1

公开(公告)日：2022-06-16

申请号：US17455062

申请日：2021-11-16

Applicant: DISCO CORPORATION

Inventor： Takashi OKAMURA ,  Shigenori HARADA

IPC: B24B9/06 ,  B24B37/30 ,  B28D5/00 ,  B28D5/02

Abstract: An edge trimming method for cutting an outer peripheral portion of a workpiece having a chamfered part on the outer peripheral portion. The method includes a cut in step of relatively moving a rotating cutting blade and a chuck table to cause the blade to cut into the outer peripheral portion, a cutting step of, after the cut in step, rotating the chuck table and causing the outer peripheral portion to be cut, to form an annular step, and a moving step of, after the cutting step, moving the blade in a direction of its axis of rotation to form another annular step adjacent to the first-mentioned annular step. The cut in, cutting, and moving steps are repeated in this order, and a stepped oblique region is formed on the outer peripheral portion, with a thickness increasing from an outermost peripheral edge toward an inner side of the workpiece.

公开(公告)号：US20220055242A1

公开(公告)日：2022-02-24

申请号：US17392505

申请日：2021-08-03

Applicant: DISCO CORPORATION

Inventor： Takashi OKAMURA ,  Shigenori HARADA

IPC: B26D7/08 ,  H01L21/78 ,  B28D5/04

Abstract: Provided is a cutting method of cutting a workpiece by using a cutting apparatus including a chuck table configured to hold the workpiece and a cutting unit having a cutting blade configured to cut the workpiece held by the chuck table and an ultrasonic vibrator configured to ultrasonically vibrate the cutting blade in a radial direction of the cutting blade. The cutting method includes a holding step of holding the workpiece by the chuck table, and a cutting step of performing ultrasonic cutting that cuts the workpiece by the cutting blade vibrated ultrasonically and normal cutting that cuts the workpiece by the cutting blade not vibrated ultrasonically on the same cutting line of a plurality of cutting lines set on the workpiece.

公开(公告)号：US20210391217A1

公开(公告)日：2021-12-16

申请号：US17330590

申请日：2021-05-26

Applicant: DISCO CORPORATION

Inventor： Takashi OKAMURA ,  Shigenori HARADA ,  Tomoharu TAKITA

IPC: H01L21/78 ,  H01L23/544 ,  H01L21/683

Abstract: There is provided a processing method of a wafer for processing the wafer that includes, on a front surface side, a device region in which a device is formed in each of plural regions marked out by plural planned dividing lines and includes a recess part on the back surface side and includes an annular reinforcing part at a peripheral part. The processing method of a wafer includes a holding step of holding the bottom surface of the recess part, a cutting step of cutting the wafer along the planned dividing lines by a cutting blade to divide the device region into plural device chips and form grooves on the front surface side of the reinforcing part, and a dividing step of dividing the reinforcing part along the planned dividing lines with the grooves being the points of origin by giving an external force to the reinforcing part.

公开(公告)号：US20200307010A1

公开(公告)日：2020-10-01

申请号：US16807915

申请日：2020-03-03

Applicant: DISCO CORPORATION

Inventor： Takafumi OMORI ,  Shigenori HARADA ,  Takashi OKAMURA

IPC: B26D5/00 ,  B26D1/04 ,  B26D3/06

Abstract: A processing apparatus includes a cutting blade mounted on a spindle, the cutting blade having a cutting edge for cutting a workpiece held on a holding table, a measuring portion for measuring an edge projection amount of the cutting edge at a predetermined frequency, and a data processing portion. The data processing portion includes a lower limit recording portion for recording a lower limit of the edge projection amount of the cutting edge as an allowable limit for use of the cutting blade, a storing portion for storing blade information including the edge projection amount measured by the measuring portion and a cutting distance traveled by the cutting blade at the time of measurement of the edge projection amount.

公开(公告)号：US20200035559A1

公开(公告)日：2020-01-30

申请号：US16513988

申请日：2019-07-17

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Takashi OKAMURA ,  Jinyan ZHAO

IPC: H01L21/78 ,  H01L21/683 ,  C08J5/18

Abstract: A wafer processing method includes: a wafer providing step of providing a wafer by placing a thermoplastic polymer sheet on an upper surface of a substrate on which the wafer is supported and positioning a back surface of the wafer on an upper surface of the polymer sheet; a sheet thermocompression bonding step of evacuating an enclosing environment in which the wafer is provided through the polymer sheet on the substrate, heating the polymer sheet, and pressing the wafer toward the polymer sheet to pressure-bond the wafer through the polymer sheet to the substrate; and a dividing step of positioning a cutting blade on the front surface of the wafer and cutting the wafer along the division lines to divide the wafer into individual device chips.