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公开(公告)号：US11662784B2
公开(公告)日：2023-05-30
申请号：US17579401
申请日：2022-01-19
申请人： Dell Products L.P.
发明人： Yong-Teng Lin , Jeffrey D. Kane
摘要： An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.
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公开(公告)号：US20220147122A1
公开(公告)日：2022-05-12
申请号：US17579401
申请日：2022-01-19
申请人： Dell Products L.P.
发明人： Yong-Teng Lin , Jeffrey D. Kane
摘要： An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.
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公开(公告)号：US11294435B2
公开(公告)日：2022-04-05
申请号：US16220712
申请日：2018-12-14
申请人： Dell Products L.P.
发明人： Yong-Teng Lin , Jeffrey D. Kane
摘要： An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.
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