公开(公告)号：US20160006908A1

公开(公告)日：2016-01-07

申请号：US14323558

申请日：2014-07-03

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： BINGHUA PAN ,  YEW KWANG LOW ,  SIM YING YONG ,  LAY BOON ONG ,  ZHIWU ZHANG

IPC: H04N5/225 ,  H04N7/18 ,  B60R1/00

CPC classification number: H04N5/2252 ,  B60R1/00 ,  B60R11/04 ,  B60R2011/004 ,  G03B17/08 ,  H04N5/2254 ,  H04N5/2257 ,  H04N7/183

Abstract: A molded camera suitable for use on a vehicle to capture an image of a field-of-view about the vehicle includes a circuit board assembly, a pigtail connector, an imager device, a lens assembly, and a polymeric compound. The pigtail connector is attached to the circuit board assembly. The imager device is attached to the circuit board assembly. The lens assembly is configured to focus the image of the field-of-view about the vehicle on the imager device. The polymeric compound is configured to encapsulate the circuit board assembly, seal/protect the molded camera and define an external portion of an exterior surface of the molded camera.

Abstract translation: 适于在车辆上使用的模制照相机捕获关于车辆的视场图像包括电路板组件，尾纤连接器，成像器装置，透镜组件和聚合物。 引线连接器连接到电路板组件。 成像器装置连接到电路板组件。 镜头组件被配置成将关于车辆的视场的图像聚焦在成像器设备上。 高分子化合物被配置为封装电路板组件，密封/保护模制照相机并且限定模制照相机的外表面的外部部分。

公开(公告)号：US20150084150A1

公开(公告)日：2015-03-26

申请号：US14036017

申请日：2013-09-25

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： BINGHUA PAN ,  YEW KWANG LOW ,  SIM YING YONG

IPC: H01L31/02 ,  H01L27/146

CPC classification number: H01L31/02005 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate is provided. The assembly includes a spacer between the device and the substrate. The spacer is configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls. The spacer includes one of solder mask, tape, and/or legend ink.

Abstract translation: 提供了一种将球栅阵列（BGA）封装的相机装置附接到印刷电路板（PCB）基板的组件。 组件包括在装置和基板之间的间隔件。 隔离件构造成防止在焊球回流期间位于装置和基板之间的焊球的过度塌陷。 间隔物包括焊接掩模，胶带和/或图例油墨之一。