Method and device for producing thin wafers from a film of active ingredients
    11.
    发明授权
    Method and device for producing thin wafers from a film of active ingredients 有权
    用于从活性成分的薄膜生产薄晶片的方法和装置

    公开(公告)号:US07749417B2

    公开(公告)日:2010-07-06

    申请号:US10467894

    申请日:2002-02-04

    IPC分类号: B28B11/16 B28B11/12 B26D7/06

    摘要: The invention relates to a method and a device for producing small, thin sheets from an active-ingredient film (2), in which the latter is produced by casting the film material onto a substrate material or by coating a substrate material, storing it with or without substrate material on a reel, pulling it off the reel and cutting it. It achieves the object of designing a method of this type in such a way that with this method small sheets can be produced as exactly as possible in predetermined sizes. To do this, the active-ingredient film (2) is pulled off automatically, is separated from a substrate material which, if present, and in tensioned form, is fed to a cutting station and is cut, in the feed direction, into long, narrow strips (7) of predeterminable width, and the long strips (7) are brought together in the feed direction and together are fed by a further feed device (10) to a transverse cutter (11), which cuts through the combined long strips (7) at predetermined intervals.

    摘要翻译: 本发明涉及一种从活性成分薄膜(2)制造小薄片的方法和装置,其中后者是通过将薄膜材料浇铸到基底材料上或通过涂覆基底材料制成,将其与 或者在卷轴上没有基材,将其从卷轴上拉出并切割。 实现了以这种方式设计这种方法的目的,即通过这种方法可以以预定尺寸尽可能精细地生产小片材。 为了做到这一点,活性成分薄膜(2)被自动地拉离,与基底材料分开,如果存在并且以张紧的形式将其送入切割站,并且在进料方向上被切割成长的 ,可预定宽度的窄条(7)和长条(7)沿进给方向一起放在一起,并由另一馈送装置(10)馈送到横切刀(11),横切刀(11)穿过组合的长 条(7)以预定间隔。