Abstract:
An object of the present invention is to provide a manufacturing method of a conductor capable of forming a conductive film having excellent rub resistance. Another object of the present invention is to provide a manufacturing method of an electromagnetic wave shielding body, and a conductor. The manufacturing method of a conductor of the present invention includes an ink preparation step of preparing a first ink containing at least a metal salt or a metal complex and a second ink containing at least a metal salt or a metal complex, a step 1 of forming a first coating film on a substrate using the first ink, and subjecting the first coating film to at least one first curing treatment selected from the group consisting of a heating treatment and a light irradiating treatment to form a first conductive film, and a step 2 of forming a second coating film on the first conductive film using the second ink, and subjecting the second coating film to at least one second curing treatment selected from the group consisting of a heating treatment and a light irradiating treatment to form a second conductive film, in which thicknesses of the first coating film and the second coating film and treatment conditions of the first curing treatment and the second curing treatment satisfy predetermined relational expressions.
Abstract:
Provided is a manufacturing method of a printed circuit board, which has excellent coverage of an electromagnetic wave shielding layer and excellent electromagnetic wave shielding characteristics. A manufacturing method of a printed circuit board that includes a printed wiring board having a ground wiring line, at least one semiconductor device mounted in a region surrounded by the ground wiring line on the printed wiring board, an insulating layer that embeds at least one of the semiconductor device, is disposed inside the ground wiring line, and has an inclined part at an outer edge, and an electromagnetic wave shielding layer disposed on the insulating layer, the method includes a step of forming, on the printed wiring board on which the semiconductor device is mounted, a layer by gradually reducing an outer edge of a jetting region of an insulating ink from a printed wiring board side such that the inclined part is formed to form the insulating layer having the inclined part, in a case where the layer is laminated by performing a step of forming the layer by jetting the insulating ink with an ink jet a plurality of times; and a step of forming, on the insulating layer, the electromagnetic wave shielding layer by jetting a conductive ink with an ink jet.
Abstract:
An ink composition includes a graft copolymer including a repeating unit having a partial structure represented by Formula (1) described below and a repeating unit having a hydrophilic group in which a graft chain includes the repeating unit and water.
Abstract:
An ink composition with excellent solvent resistance of the recorded image and fixability to a recording medium which may be applicable to an ink jet recording method, and an image forming method using the ink composition are provided. An ink composition which includes a dispersion medium including (a) water, and particles of (b) a polymer compound and (b) the polymer compound includes a repeating unit having a partial structure represented by the following General Formula (1) is provided. In the following General Formula (1), Ra and Rb, each independently, represent an alkyl group having the number of carbon atoms 1 to 4, and Ra and Rb may be bonded to each other to form an alicyclic structure with 4- to 6-membered ring and * represents a bonding site to a main chain or a side chain in the polymer compound.
Abstract:
An ink composition of the present invention includes: (a) a polymer compound which includes a repeating unit (a-1) having a partial structure expressed by the following General Formula (1), a repeating unit (a-2) which has a hydrophilic group and accounts for 8% to 25% by mass with respect to the total mass of the polymer compound, and a repeating unit (a-3) having a hydrophobic group, the polymer compound having a solubility parameter in an unneutralized state of 20.7 MPa1/2 to 23.0 MPa1/2, (b) water; and (c) a water-soluble organic solvent.