公开(公告)号：US20140348290A1

公开(公告)日：2014-11-27

申请号：US13901198

申请日：2013-05-23

Applicant: General Electric Company

Inventor： Daniel David Harrison ,  James Rose ,  Abdelaziz Ikhlef ,  Vladimir Lobastov

IPC: G01T1/16 ,  G01N23/04

CPC classification number: G01N23/046 ,  G01T1/244

Abstract: A direct-conversion X-ray detector includes one or more detector modules. The detector modules can include a substrate, one or more sensor tiles, and one or more photon-counting application specific integrated circuit (ASIC). The substrate has a dielectric constant of less than about 3.5 and is capable of lithographic conductor patterning with feature sizes of about 5 um or less. The one or more X-ray direct conversion sensor tiles have an array of one or more electrodes electrically coupled to a first surface of the substrate. The one or more ASICs are electrically coupled to the substrate and disposed laterally along the substrate with respect to the one or more direct conversion sensor tiles. Conductive lines are spaced along the substrate and are configured to electrically couple the one or more X-ray direct conversion sensor tiles to the one or more ASICs.

Abstract translation: 直接转换X射线检测器包括一个或多个检测器模块。 检测器模块可以包括基板，一个或多个传感器瓦片以及一个或多个光子计数专用集成电路（ASIC）。 该基片具有小于约3.5的介电常数，并且能够具有大约5um或更小的特征尺寸的平版印刷导体图案化。 一个或多个X射线直接转换传感器瓦片具有电耦合到基板的第一表面的一个或多个电极的阵列。 一个或多个ASIC电耦合到衬底并相对于一个或多个直接转换传感器瓦片沿着衬底横向设置。 导电线沿着衬底间隔开并且被配置为将一个或多个X射线直接转换传感器瓦片电耦合到一个或多个ASIC。

公开(公告)号：US20150071401A1

公开(公告)日：2015-03-12

申请号：US14020395

申请日：2013-09-06

Applicant: General Electric Company

Inventor： Joseph James Lacey ,  Abdelaziz Ikhlef ,  Baiju Zacharia Babu

IPC: G01T7/00 ,  G01T1/16 ,  G01N23/04

CPC classification number: G01T7/005 ,  A61B6/032 ,  A61B6/4233 ,  G01N23/046 ,  G01T1/16

Abstract: CT detector modules are disclosed that include a module frame and a plurality of tileable detector sensors positioned on the module frame. Each of the tileable detector sensors includes an array of detector elements and a mounting structure directly or indirectly coupled to the detector elements to provide for a mounting and alignment of the detector sensor to the module frame. The mounting structure includes an alignment plate positioned generally opposite the array of detector elements, with the alignment plate having alignment pins forming a datum structure to align the detector sensor on the module frame and one or more threaded bosses configured to receive a fastener therein that secures the detector sensor to the module frame. The module frame includes keyed features that receive the alignment pins when the detector sensors are mounted on the module frame, so as to align the detector sensors on the module frame.

Abstract translation: 公开了CT检测器模块，其包括位于模块框架上的模块框架和多个可瓦片检测器传感器。 每个可瓦片检测器传感器包括检测器元件的阵列和直接或间接耦合到检测器元件的安装结构，以提供检测器传感器与模块框架的安装和对准。 安装结构包括大体上与检测器元件阵列相对定位的对准板，对准板具有对准销，其形成基准结构，以将检测器传感器对准在模块框架上，以及一个或多个螺纹凸台，其构造成在其中接纳紧固件， 检测器传感器到模块框架。 模块框架包括当检测器传感器安装在模块框架上时接收对准引脚的键控功能，以便将检测器传感器对准模块框架。

公开(公告)号：US20150063531A1

公开(公告)日：2015-03-05

申请号：US14011897

申请日：2013-08-28

Applicant: General Electric Company

Inventor： Abdelaziz Ikhlef

IPC: G01T1/20 ,  G01N23/04

CPC classification number: G01T1/20 ,  G01N23/046 ,  G01T1/2985 ,  G21K1/025

Abstract: A detector assembly for a CT imaging system includes a scintillator array comprising a plurality of scintillator cells, and configured to detect high frequency electromagnetic energy attenuated through an object, the scintillator array including a reflective material positioned around each of the plurality of scintillator cells to form reflector channels between each of the plurality of scintillator cells. The CT imaging system also includes a collimator positioned proximate the scintillator array and configured to filter the high frequency electromagnetic energy attenuated through the object prior to impinging on the scintillator array, the collimator comprising a plurality of collimator plates arranged to form a plurality of channels. The reflector channels in the scintillator array are formed to have a first thickness and the collimator plates of the collimator are formed to have a second thickness that is equal to or less than the first thickness.

Abstract translation: 用于CT成像系统的检测器组件包括闪烁体阵列，其包括多个闪烁体单元，并且被配置为检测通过物体衰减的高频电磁能量，该闪烁体阵列包括位于多个闪烁体单元周围的反射材料，以形成 在多个闪烁体单元中的每一个之间的反射器通道。 CT成像系统还包括靠近闪烁体阵列定位的准直器，并且被配置为过滤在撞击闪烁体阵列之前通过物体衰减的高频电磁能，准直器包括多个准直器板，其被布置成形成多个通道。 闪烁体阵列中的反射器通道形成为具有第一厚度，准直器的准直板被形成为具有等于或小于第一厚度的第二厚度。

公开(公告)号：US20140341355A1

公开(公告)日：2014-11-20

申请号：US14451504

申请日：2014-08-05

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Jiang Hsieh ,  Thomas Murray Leeds ,  Abdelaziz Ikhlef

IPC: G21K1/02

CPC classification number: G21K1/02 ,  A61B6/03 ,  A61B6/032 ,  A61B6/4014 ,  A61B6/4291 ,  A61B6/482 ,  A61B6/583 ,  A61N5/10 ,  G02B27/10 ,  G02B27/30 ,  G21K1/025 ,  G21K1/04 ,  H01L27/14625 ,  H01L27/14818 ,  Y10T29/49826

Abstract: A collimator for an imaging system includes a first region comprising a first one-dimensional array of apertures along a channel direction, and a second region comprising a second one-dimensional array of apertures along the channel direction, wherein an aspect ratio of the apertures of the first region is greater than an aspect ratio of the second region.

Abstract translation: 用于成像系统的准直器包括第一区域，其包括沿通道方向的孔的第一一维阵列，以及包括沿着通道方向的孔的第二一维阵列的第二区域，其中孔的纵横比 第一区域大于第二区域的纵横比。

公开(公告)号：US20150146842A1

公开(公告)日：2015-05-28

申请号：US14091081

申请日：2013-11-26

Applicant: General Electric Company

Inventor： Haruo Kurochi ,  Abdelaziz Ikhlef

IPC: G21F1/00 ,  G21K1/02 ,  G01N23/04 ,  G01T1/20

CPC classification number: G21F1/00 ,  G01N23/046 ,  G01T1/2985 ,  G21K1/025

Abstract: A detector module for a radiation detector in a radiation imaging apparatus is provided. The detector module includes a detecting element array including a plurality of detecting elements arranged in a matrix form in first and second directions orthogonal to each other, the detecting element array configured to allow radiation to penetrate through spaces defined between the detecting elements, an electronic circuit arranged on a radiation emission side of the detecting element array, and a radiation shielding body arranged on a radiation incident side of the detecting element array. The radiation shielding body includes a base material having radiation permeability and formed with a plurality of grooves extending in the first direction at respective positions corresponding to spaces between the detecting elements in the second direction, and a plurality of radiation shielding materials each inserted in a respective groove of the plurality of grooves.

Abstract translation: 提供了一种用于放射线成像设备中的辐射检测器的检测器模块。 检测器模块包括检测元件阵列，该检测元件阵列包括在彼此正交的第一和第二方向上以矩阵形式布置的多个检测元件，所述检测元件阵列被配置为允许辐射穿过检测元件之间的空间，电子电路 布置在检测元件阵列的辐射发射侧，以及布置在检测元件阵列的辐射入射侧的辐射屏蔽体。 辐射屏蔽体包括具有辐射透射性的基底材料，并且形成有沿与第二方向相对应的检测元件之间的空间的各个位置沿着第一方向延伸的多个凹槽，以及多个辐射屏蔽材料， 槽。

公开(公告)号：US20140301534A1

公开(公告)日：2014-10-09

申请号：US13857624

申请日：2013-04-05

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Naresh Kesavan Rao ,  James Wilson Rose ,  Christopher David Unger ,  Abdelaziz Ikhlef ,  Jonathan David Short

IPC: G01T1/20 ,  G01N23/04

CPC classification number: G01T1/247 ,  A61B6/42 ,  A61B6/4233 ,  H01L27/14661 ,  H01L27/14663

Abstract: Improved imaging systems are disclosed. More particularly, the present disclosure provides for an improved image sensor assembly for an imaging system, the image sensor assembly having an integrated photodetector array and its associated data acquisition electronics fabricated on the same substrate. By integrating the electronics on the same substrate as the photodetector array, this thereby reduces fabrications costs, and reduces interconnect complexity. Since both the photodiode contacts and the associated electronics are on the same substrate/plane, this thereby substantially eliminates certain expensive/time-consuming processing techniques. Moreover, the co-location of the electronics next to or proximal to the photodetector array provides for a much finer resolution detector assembly since the interconnect bottleneck between the electronics and the photodetector array is substantially eliminated/reduced. The co-location of the electronics next to or proximal to the photodetector array also enables/facilitates programmable pixel configuration for optimal image quality.

Abstract translation: 公开了改进的成像系统。 更具体地，本公开提供了一种用于成像系统的改进的图像传感器组件，该图像传感器组件具有集成的光电检测器阵列及其在相同基板上制造的相关联的数据采集电子装置。 通过将电子元件集成在与光电检测器阵列相同的基板上，由此降低了制造成本，并降低了互连复杂度。 由于光电二极管触点和相关联的电子器件都在相同的衬底/平面上，因此基本上消除了某些昂贵/耗时的处理技术。 此外，由于电子设备和光电检测器阵列之间的互连瓶颈基本上被消除/减少，所以电子器件靠近光电检测器阵列的共同定位提供了更精细的分辨率检测器组件。 靠近或接近光电检测器阵列的电子设备的共同位置也使得/促进可编程像素配置以获得最佳图像质量。