公开(公告)号：US20130255931A1

公开(公告)日：2013-10-03

申请号：US13690376

申请日：2012-11-30

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Michael Douglas ARNETT ,  Rebecca Evelyn HEFNER

IPC: F28F27/00

CPC classification number: F28F27/00 ,  F28B1/02 ,  F28D5/00 ,  F28D7/106 ,  F28D15/02 ,  F28F13/06 ,  F28F13/12 ,  F28F2255/04

Abstract: A heat transfer component and heat transfer process are disclosed. The heat transfer component includes thermally-responsive features positioned along a surface of the heat transfer component. The thermally-responsive features deploy from or retract toward the surface in response to a predetermined temperature change. The deploying from or the retracting toward of the thermally-responsive features increases or decreases a rate of heat transfer between a flow along the surface and the surface. The heat transfer process includes providing a heat transfer component having thermally-responsive features positioned along a surface of the heat transfer component; and increasing or decreasing a heat transfer rate between the surface and a flow by deploying the thermally-responsive features from or the retracting the thermally-responsive features toward the surface in response to a predetermined temperature change.

Abstract translation: 公开了一种传热部件和传热过程。 传热部件包括沿着传热部件的表面定位的热响应特征。 响应于预定的温度变化，热响应特征从表面展开或缩回。 从热响应特征展开或向后回缩的方式增加或减少沿着表面和表面的流动之间的热传递速率。 传热过程包括提供具有沿着传热部件的表面定位的热响应特征的传热部件; 以及响应于预定的温度变化，通过从所述热响应特征部署所述热响应特征或使所述热响应特征朝向所述表面而增加或减少所述表面和流之间的热传递速率。