公开(公告)号：US12074080B2

公开(公告)日：2024-08-27

申请号：US18107968

申请日：2023-02-09

申请人： Micron Technology, Inc.

发明人： Maksim Kuzmenka

IPC分类号： H01L23/367 ,  B21D53/02 ,  H01L23/373

CPC分类号： H01L23/3672 ,  H01L23/3675 ,  B21D53/022 ,  F28F2255/04 ,  H01L23/3736

摘要： Systems for cooling semiconductor devices that can comprise a heatsink and a cleaning element for the heatsink. The heatsink can have fins spaced apart from each other by channels. The cleaning element can have a base and one or more arms extending from the base. The cleaning element can be positioned with respect to the heatsink such that each arm is aligned with a corresponding channel between the fins, and the arms are moveable between a flow configuration in which the arms are in the channels and a cleaning configuration in which the arms are outside of the channels.

公开(公告)号：US20190249937A1

公开(公告)日：2019-08-15

申请号：US16390321

申请日：2019-04-22

申请人： Raytheon Company

发明人： Adam C. Woods ,  Charles J. Bersbach

IPC分类号： F28F13/00 ,  H05K7/20 ,  F42B15/34 ,  F03G7/06

CPC分类号： F28F13/00 ,  F03G7/065 ,  F28F21/02 ,  F28F2013/006 ,  F28F2013/008 ,  F28F2255/04 ,  F42B15/34 ,  H01L23/3737 ,  H01L23/433 ,  H05K7/1434 ,  H05K7/20445

摘要： A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.

公开(公告)号：US20170328654A1

公开(公告)日：2017-11-16

申请号：US15418783

申请日：2017-01-30

申请人： Evening Star Technology Development Ltd.

发明人： Thomas Jaspero Cognata ,  Darren Hartl ,  Craig Dinsmore

IPC分类号： F28F13/14 ,  F28F3/02

CPC分类号： F28F13/14 ,  B64G1/50 ,  F24S40/55 ,  F28D15/00 ,  F28D2021/0021 ,  F28D2021/0028 ,  F28D2021/008 ,  F28D2021/0091 ,  F28F1/12 ,  F28F1/14 ,  F28F3/02 ,  F28F5/00 ,  F28F13/00 ,  F28F13/18 ,  F28F2245/06 ,  F28F2255/02 ,  F28F2255/04

摘要： A heat rejection system that employs temperature sensitive shape memory materials to control the heat rejection capacity of a vehicle to maintain a safe vehicle temperature. The technology provides for a wide range of heat rejection rates by actuation of the orientation or position of a heat rejection panel which impacts effective properties of the heat rejection system in response to temperature. When employed as a radiator for crewed spacecraft thermal control this permits the use of higher freezing point, non-toxic thermal working fluids in single-loop thermal control systems for crewed vehicles in space and other extraterrestrial environments.

公开(公告)号：US20170211897A1

公开(公告)日：2017-07-27

申请号：US15008353

申请日：2016-01-27

申请人： HONEYWELL INTERNATIONAL INC.

发明人： Keith Agee

IPC分类号： F28F13/12 ,  F28F3/02

CPC分类号： F28F13/12 ,  F01P11/08 ,  F01P2060/04 ,  F28D9/00 ,  F28D2021/0089 ,  F28F3/02 ,  F28F3/027 ,  F28F2215/14 ,  F28F2250/04 ,  F28F2255/04

摘要： An oil cooler comprises a cooler core having an oil fin. The oil fin includes a moveable window. The moveable window includes a base and a first flap on one side of the base. The first flap moves between a closed position and an open position. The first flap is in the open position when the cooler core is in a hot condition.

公开(公告)号：US09653379B2

公开(公告)日：2017-05-16

申请号：US15066382

申请日：2016-03-10

申请人： FUJI ELECTRIC CO., LTD.

发明人： Takahiro Koyama ,  Noriho Terasawa

IPC分类号： H01L23/48 ,  H01L23/34 ,  F28F7/00 ,  F28D15/00 ,  F28F27/00 ,  H01L23/473 ,  H01L23/367 ,  H05K7/20 ,  F28F3/02 ,  F28F3/12 ,  F28F3/04 ,  F28F27/02 ,  F28F13/12 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L23/373

CPC分类号： H01L23/473 ,  F28D15/00 ,  F28F3/02 ,  F28F3/022 ,  F28F3/048 ,  F28F3/12 ,  F28F13/12 ,  F28F27/02 ,  F28F2255/04 ,  H01L23/3121 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49838 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

摘要： A cooler for cooling a semiconductor module includes a top plate; a jacket having a side plate and a bottom plate and firmly fixed to the top plate; a refrigerant inflow port through which a refrigerant flows into a space surrounded by the top plate and jacket; a refrigerant outflow port through which the refrigerant flows out from the space; a plurality of fins firmly fixed to the top plate and disposed separately on each of the left and right relative to a main refrigerant path in the jacket to be inclined toward the inflow side of the main refrigerant path; heat transfer pins disposed on the top plate on the refrigerant inflow sides of the fins; and a curved plate-like bimetal valve having one end connected to each respective heat transfer pin and another free end.

公开(公告)号：US09322319B2

公开(公告)日：2016-04-26

申请号：US13529795

申请日：2012-06-21

申请人： Jae Yeon Kim

发明人： Jae Yeon Kim

IPC分类号： G05D16/00 ,  F01P11/08 ,  F01P3/18 ,  F28F27/02 ,  F28D9/00 ,  F28D21/00

CPC分类号： F01P11/08 ,  F01P3/18 ,  F01P2060/045 ,  F01P2060/08 ,  F28D9/005 ,  F28D9/0093 ,  F28D2021/0089 ,  F28F27/02 ,  F28F2250/06 ,  F28F2255/04

摘要： A heat exchanger for a vehicle may include a heat radiating portion provided with first, second and third connecting lines and receiving first, second, and third operating fluids respectively and a bifurcating portion connecting one of inflow holes formed to the heat radiating portion for flowing one operating fluid of the first, second, and third operating fluids with one of exhaust holes formed to the heat radiating portion for exhausting the one operating fluid, wherein the bifurcating portion may be mounted at an exterior of the heat radiating portion, and wherein the bifurcating portion bypasses the one operating fluid from the heat radiating portion according to a temperature of the one operating fluid.

摘要翻译： 一种用于车辆的热交换器可以包括分别设置有第一，第二和第三连接线并分别容纳第一，第二和第三工作流体的热辐射部分，以及连接形成于散热部分的流入孔中的一个的分叉部分，用于使一个 第一，第二和第三工作流体的工作流体，其中一个排气孔形成于散热部分，用于排出一个工作流体，其中分叉部分可以安装在散热部分的外部，并且其中分叉 部分根据一个工作流体的温度绕过来自散热部分的一个工作流体。

公开(公告)号：US09145853B2

公开(公告)日：2015-09-29

申请号：US14023935

申请日：2013-09-11

申请人： GM GLOBAL TECHNOLOGY OPERATIONS LLC

发明人： Alan L. Browne ,  Nancy L. Johnson ,  Patrick G. Szymkowicz

IPC分类号： F02M25/07

CPC分类号： F02M25/0737 ,  F01P2060/16 ,  F02M26/32 ,  F28D7/16 ,  F28D21/0003 ,  F28F1/08 ,  F28F13/00 ,  F28F13/08 ,  F28F19/00 ,  F28F2255/04

摘要： An exhaust gas recirculation (EGR) cooler for cooling exhaust gas via a coolant includes at least one channel having an inlet and an outlet, and a casing defining a cooling chamber for carrying the coolant around the at least one channel. The exhaust gas is flowable through the at least one channel from the inlet to the outlet. At least a portion of the at least one channel is variable between a fully compressed position and an uncompressed position. The casing includes a coolant inlet and a coolant outlet through which the coolant enters and exits the cooling chamber. The casing also includes an exhaust gas inlet from which the exhaust gas enters the at least one channel, and an exhaust gas outlet into which the exhaust gas exits the at least one channel.

摘要翻译： 用于经由冷却剂冷却废气的废气再循环（EGR）冷却器包括至少一个具有入口和出口的通道，以及限定用于将冷却剂携带在至少一个通道周围的冷却室的壳体。 废气可以从入口到出口流过至少一个通道。 所述至少一个通道的至少一部分在完全压缩位置和未压缩位置之间是可变的。 壳体包括冷却剂入口和冷却剂出口，冷却剂通过该冷却剂出口进入和离开冷却室。 壳体还包括排气进入至少一个通道的废气入口和排气离开至少一个通道的废气出口。

公开(公告)号：US20150053390A1

公开(公告)日：2015-02-26

申请号：US14463091

申请日：2014-08-19

申请人： Ingersoll-Rand Company

发明人： Russell A. Banks ,  James Christopher Collins

IPC分类号： F28F13/12 ,  F28F1/40 ,  F16N39/02 ,  F28F9/24

CPC分类号： F28F13/12 ,  F04C29/02 ,  F04C29/042 ,  F16N39/02 ,  F28D7/16 ,  F28D2021/0049 ,  F28F1/40 ,  F28F2255/04

摘要： A compressor system is disclosed that includes at least one fluid compressor for compressing a working fluid and a lubrication supply system operable for supplying lubrication fluid to the compressor. A heat exchanger is provided for controlling the temperature of the lubrication fluid. The heat exchanger includes a housing for holding a plurality of lubrication fluid passageways. A shape memory alloy (SMA) member is positioned within at least one of the plurality of lubrication fluid passageways to increase turbulence in the lubrication fluid at relatively high temperatures.

摘要翻译： 公开了一种压缩机系统，其包括用于压缩工作流体的至少一个流体压缩机和可操作用于向压缩机供应润滑流体的润滑供应系统。 提供一种热交换器来控制润滑流体的温度。 热交换器包括用于保持多个润滑流体通道的壳体。 形状记忆合金（SMA）构件定位在多个润滑流体通道中的至少一个中，以在相对高的温度下增加润滑流体中的湍流。

公开(公告)号：US08561386B2

公开(公告)日：2013-10-22

申请号：US12988398

申请日：2009-04-15

申请人： Claude Marcel Mons

发明人： Claude Marcel Mons

IPC分类号： F02K99/00

CPC分类号： F28F1/10 ,  C08L2201/12 ,  F01D25/12 ,  F02C7/12 ,  F02K3/06 ,  F02K3/077 ,  F05D2260/2214 ,  F05D2260/22141 ,  F05D2300/505 ,  F28F2013/008 ,  F28F2255/04 ,  Y02T50/676

摘要： A wall-cooling device for cooling a wall subjected to a heat source and to an outer fluid. The device includes a cooling part with a fastening portion and a cooling portion. The cooling part is made of a thermally-conductive shape-memory alloy having a transition temperature T. The fastener portion is for fastening the device rigidly on a face of the wall. The cooling portion is shaped so that it takes up a first position that is substantially parallel to the wall when the temperature of the wall is lower than the temperature T and so that it takes up a second position in which a plane of the second portion defines, relative to a plane tangential to the wall, a dihedral angle lying in the range 45° to 90° .

摘要翻译： 一种用于冷却经受热源和外部流体的壁的壁冷却装置。 该装置包括具有紧固部分和冷却部分的冷却部分。 冷却部件由具有转变温度T的导热形状记忆合金制成。紧固件部分用于将装置刚性地紧固在壁的表面上。 冷却部分成形为当壁的温度低于温度T时，其占据基本上平行于壁的第一位置，并且使得其占据第二位置，其中第二部分的平面限定在第二位置 相对于与壁相切的平面，位于45°至90°范围内的二面角。

公开(公告)号：US20130139538A1

公开(公告)日：2013-06-06

申请号：US13755455

申请日：2013-01-31

申请人： FUJITSU LIMITED

发明人： Noriyasu ASO ,  Toshio MANABE

IPC分类号： F25B13/00

CPC分类号： F25B30/04 ,  F25B17/08 ,  F25B35/04 ,  F28D1/05366 ,  F28D21/0015 ,  F28F2255/04 ,  Y02A30/278 ,  Y02B30/64

摘要： An adsorption heat pump includes: an evaporator configured to evaporate a refrigerant; and an adsorbent heat exchanger provided with an adsorption member configured to adsorb vapor evaporated by the evaporator, and a heat transfer tube in which a heating medium flows. Here, the adsorbent heat exchanger includes a pressing mechanism configured to press and compress the adsorption member depending on a temperature of the heating medium flowing inside the heat transfer tube.

摘要翻译： 吸附热泵包括：蒸发器，其被配置为蒸发制冷剂; 以及吸附热交换器，其设置有吸附构件，吸附构件用于吸附由蒸发器蒸发的蒸汽，以及传热管，其中加热介质流动。 这里，吸附热交换器包括：压力机构，其构造为根据在传热管内部流动的加热介质的温度来压缩和吸附吸附部件。