公开(公告)号：US10529831B1

公开(公告)日：2020-01-07

申请号：US16054881

申请日：2018-08-03

Applicant: GLOBALFOUNDRIES INC.

Inventor： Qun Gao ,  Matthew W. Stoker ,  Haigou Huang

IPC: H01L29/78 ,  H01L29/66

Abstract: At least one method, apparatus and system providing semiconductor devices comprising a semiconductor substrate; a first fin and a second fin on the semiconductor substrate; a first epitaxial formation on the first fin and having an inner surface oriented toward the second fin and an outer surface oriented away from the second fin; a second epitaxial formation on the second fin and having an inner surface oriented toward the first fin and an outer surface oriented away from the first fin; and a conformal dielectric layer on at least portions of the inner and outer surfaces of the first epitaxial formation, on at least portions of the inner and outer surfaces of the first epitaxial formation and the second epitaxial formation, and merged between the inner surface of the first epitaxial formation and inner surface of the second epitaxial formation.

公开(公告)号：US20190043944A1

公开(公告)日：2019-02-07

申请号：US15667376

申请日：2017-08-02

Applicant: GLOBALFOUNDRIES INC.

Inventor： Matthew W. Stoker ,  Judson R. Holt ,  Timothy J. McArdle ,  Annie Lévesque

IPC: H01L29/06 ,  H01L27/108 ,  H01L21/02 ,  H01L29/49 ,  H01L29/423

Abstract: At least one method, apparatus and system disclosed herein involves forming increased surface regions within EPI structures. A fin on a semiconductor substrate is formed. On a top portion of the fin, an epitaxial (EPI) structure is formed. The EPI structure has a first EPI portion having a first material and a second EPI portion having a second material. The first and second EPI portions are separated by a first separation layer. A first cavity is formed within the EPI structure by removing a portion of the second material in the second portion. A first conductive material is deposited into the first cavity.

公开(公告)号：US10121706B2

公开(公告)日：2018-11-06

申请号：US15361809

申请日：2016-11-28

Applicant: GLOBALFOUNDRIES INC.

Inventor： Rinus T. P. Lee ,  Bharat V. Krishnan ,  Hui Zang ,  Matthew W. Stoker

IPC: H01L29/06 ,  H01L21/8238 ,  H01L29/32 ,  H01L27/092

Abstract: One aspect of the disclosure is directed to a method of forming a semiconductor structure. The method including: removing each fin in a set of fins from between insulator pillars to expose a portion of a substrate between each insulator pillar, the substrate having a first device region and a second device region; forming a first material over the exposed portions of the substrate between each insulator pillar, the first material including a two-dimensional material; forming a second material over the first material in the first device region, the second material including a first three-dimensional bonding material; and forming a third material over the exposed first material in the second device region, the third material including a second three-dimensional bonding material.

公开(公告)号：US08618617B2

公开(公告)日：2013-12-31

申请号：US13783526

申请日：2013-03-04

Applicant: International Business Machines Corporation ,  GlobalFoundries, Inc.

Inventor： Kevin K. Chan ,  Abhishek Dube ,  Eric C. Harley ,  Judson R. Holt ,  Viorel C. Ontalus ,  Kathryn T. Schonenberg ,  Matthew W. Stoker ,  Keith H. Tabakman ,  Linda R. Black

IPC: H01L27/088

CPC classification number: H01L29/7848 ,  H01L21/26586 ,  H01L21/823412 ,  H01L21/823425 ,  H01L21/823481 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/84 ,  H01L29/66628 ,  H01L29/66772 ,  H01L29/78618 ,  H01L29/78684

Abstract: A method for forming a field effect transistor device includes forming a gate stack portion on a substrate, forming a spacer portion on the gates stack portion and a portion of the substrate, removing an exposed portion of the substrate, epitaxially growing a first silicon material on the exposed portion of the substrate, removing a portion of the epitaxially grown first silicon material to expose a second portion of the substrate, and epitaxially growing a second silicon material on the exposed second portion of the substrate and the first silicon material.

Abstract translation: 一种用于形成场效应晶体管器件的方法，包括：在衬底上形成栅极叠层部分，在栅堆叠部分和衬底的一部分上形成间隔部分，去除衬底的暴露部分，将第一硅材料外延生长 衬底的暴露部分，去除外延生长的第一硅材料的一部分以暴露衬底的第二部分，以及在衬底的暴露的第二部分和第一硅材料上外延生长第二硅材料。