OPTICAL COMPONENTS WITH ENHANCED HEAT DISSIPATION

    公开(公告)号:US20230266529A1

    公开(公告)日:2023-08-24

    申请号:US17679405

    申请日:2022-02-24

    CPC classification number: G02B6/122 G02B6/43 G02B6/0026

    Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a waveguide core and a back-end-of-line stack including a first metallization level, a second metallization level, and a heat sink having a metal feature in the second metallization level. The heat sink is positioned adjacent to a section of the waveguide core. The first metallization level including a dielectric layer positioned between the metal feature and the section of the waveguide core.

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