公开(公告)号：US10349187B2

公开(公告)日：2019-07-09

申请号：US15781364

申请日：2015-12-14

Applicant: Goertek Inc.

Inventor： Junkai Zhan ,  Mengjin Cai ,  Guanxun Qiu ,  Zonglin Zhou ,  Qinglin Song

IPC: H04R19/00 ,  H04R19/04 ,  H04R31/00 ,  B81B7/00 ,  B81C1/00 ,  B81B7/02

Abstract: An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm (3e) and back-pole (7) which forms a condenser structure are formed on a substrate (1) having at least one recessed slot (1a) on the top. A sensitive electrode is formed on the substrate (1), the sensitive electrode comprising a fixed portion (3b) fixed on the substrate (1) via a sacrificial layer (2), and a bending portion (3a) inserted into the recessed slot (1a), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (1), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm (3e) and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate (1) at the same time, from the same material, and using the same fabricating process to increase production efficiency.