公开(公告)号：US20170016456A1

公开(公告)日：2017-01-19

申请号：US14802125

申请日：2015-07-17

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Fu-Yi Chen

IPC: F04D29/42 ,  F04D29/58 ,  F04D29/28 ,  F04D17/08 ,  F04D25/08

CPC classification number: F04D29/582

Abstract: Example implementations relate to a fan cover with a plurality of openings. For example, a device may include a fan cover to a fan device and a heat conduction device, a portion of the heat conduction device being coupled to an inside surface of the fan cover. The fan cover provides airflow for heat dissipation in a computing device and surrounds at least a portion of the fan device. The fan device has a first side associated with an axis about which an impeller of the fan device is capable of rotating and a second side associated with blade edges of the impeller of the fan device. The fan cover includes a flat portion to surround the first side and a curved portion to surround the second side, the curved portion having a plurality of openings such that airflow produced by the fan device is capable of passing through.

Abstract translation: 示例性实施方案涉及具有多个开口的风扇盖。 例如，设备可以包括到风扇设备的风扇盖和热传导设备，热传导设备的一部分耦合到风扇盖的内表面。 风扇盖为计算设备中的散热提供气流并且围绕风扇装置的至少一部分。 风扇装置具有与风扇装置的叶轮能够旋转的轴线相关联的第一侧和与风扇装置的叶轮的叶片边缘相关联的第二侧。 风扇盖包括围绕第一侧的平坦部分和围绕第二侧的弯曲部分，弯曲部分具有多个开口，使得由风扇装置产生的气流能够通过。