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公开(公告)号：US20210341977A1
公开(公告)日：2021-11-04
申请号：US17378029
申请日：2021-07-16
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin , Zhenming Hu , Yonghai Mao , Xiaofei Li
Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.
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公开(公告)号：US20210011534A1
公开(公告)日：2021-01-14
申请号：US16989174
申请日：2020-08-10
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin , Zhenming Hu , Yonghai Mao , Xiaofei Li
Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.
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