公开(公告)号：US10820448B2

公开(公告)日：2020-10-27

申请号：US16458711

申请日：2019-07-01

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaowei Hui ,  Yuping Hong ,  Wei Chen

IPC: H05K7/20

Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.

公开(公告)号：US10409340B2

公开(公告)日：2019-09-10

申请号：US15311927

申请日：2014-06-04

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  F28D15/02 ,  H05K7/20

Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.