公开(公告)号：US20240008207A1

公开(公告)日：2024-01-04

申请号：US18038319

申请日：2021-09-24

Applicant: Hitachi Astemo, Ltd.

Inventor： Yusuke TAKAHASHI ,  Yoshio KAWAI

IPC: H05K5/06 ,  H05K5/00 ,  H05K5/04

CPC classification number: H05K5/065 ,  H05K5/0069 ,  H05K5/006 ,  H05K5/04

Abstract: An electronic control device includes a non-conductive resin housing; a circuit board; a metal housing; a waterproof seal material; and a conductive adhesive. The circuit board has a circuit ground (GND pattern), and is held by the resin housing. The metal housing covers the circuit board and is attached to the resin housing. The waterproof seal material seals and waterproofs the resin housing and the metal housing. The conductive adhesive is in contact with the metal housing and the circuit ground, and electrically connects the metal housing to the circuit ground at a plurality of points.

公开(公告)号：US20230292470A1

公开(公告)日：2023-09-14

申请号：US17918985

申请日：2021-02-02

Applicant: Hitachi Astemo, Ltd.

Inventor： Keiko UENO ,  Yoshio KAWAI

IPC: H05K7/20

CPC classification number: H05K7/20409

Abstract: An electronic control device capable of improving cooling performance by air cooling is provided.
The electronic control device includes a circuit board 6 (board), a heat-generating component 7 (heating element) mounted on the circuit board 6, a heat dissipation material 12 (thermally conductive material) that is in contact with the heat-generating component 7 and conducts heat of the heat-generating component 7, a fin-integrated housing 3 (housing) that is in contact with the heat dissipation material 12 and covers the circuit board 6, and a cover 1 that covers the fin-integrated housing 3. The cover 1 has a hole (2) 8 and a hole (3) 9 as intake holes, and a hole (1) 2 as an exhaust hole. The hole (1) 2 is formed at a position close to the heat-generating component 7 relative to the hole (2) 8 and the hole (3) 9. The hole (2) 8 and the hole (3) 9 are formed at positions away from the heat-generating component 7 relative to the hole (1) 2.

公开(公告)号：US20230054252A1

公开(公告)日：2023-02-23

申请号：US17797000

申请日：2020-12-25

Applicant: Hitachi Astemo, Ltd.

Inventor： Miki HIRAOKA ,  Yoshio KAWAI

IPC: H05K1/02 ,  H05K7/20

Abstract: An electronic control device includes a board including a heat sink on which a heat generation element is mounted, and a housing that is in contact with the board and dissipates heat of the heat generation element to the outside. A potential of the housing is a ground, and a potential of the heat sink is a non-ground. The board includes a first layer including a first non-ground wiring that is in direct contact with the heat sink, and a second layer including a second ground wiring that is in electrical and thermal contact with the housing. The first non-ground wiring and the second ground wiring overlap each other in plan view from a thickness direction of the board.

公开(公告)号：US20220071029A1

公开(公告)日：2022-03-03

申请号：US17413722

申请日：2019-12-19

Applicant: Hitachi Astemo, Ltd.

Inventor： Ryo AKIBA ,  Yoshio KAWAI

IPC: H05K5/02 ,  H05K5/04 ,  H05K5/00

Abstract: Provided is an electronic control unit that can be used even in a mounting environment causing severe salt damage. In order to achieve the above-described object, in an electronic control unit according to the present invention, a minimum distance between a wall and a respiratory filter is set to be 3 mm or more.