公开(公告)号：US20240249993A1

公开(公告)日：2024-07-25

申请号：US18559153

申请日：2022-02-07

申请人： Hitachi Astemo, Ltd.

发明人： Ryo AKIBA ,  Yoshio KAWAI ,  Keiko UENO

IPC分类号： H01L23/367

CPC分类号： H01L23/3675

摘要： An electronic control device capable of achieving both high heat dissipation and solder connection reliability is achieved. An electronic control device 101 includes a circuit board 3 mounted with an electronic component 7 and a connector 4, a base 1 housing this circuit board 3, a cover 2 closing this base 1, a heat dissipation pedestal 9 formed on the base 1, and a thermally conductive material 8 arranged on an upper surface of this heat dissipation pedestal 9. On the upper surface of the heat dissipation pedestal 9 on which the thermally conductive material 8 is arranged, a plurality of grooves 14 formed radially from the center of the upper surface of the heat dissipation pedestal 9 and where the thermally conductive material 8 enters are formed. The electronic component 7 is configured to be in contact with the heat dissipation pedestal 9 via the thermally conductive material 8. This can achieve an electronic control device capable of achieving both high heat dissipation and solder connection reliability.

公开(公告)号：US20230292470A1

公开(公告)日：2023-09-14

申请号：US17918985

申请日：2021-02-02

申请人： Hitachi Astemo, Ltd.

发明人： Keiko UENO ,  Yoshio KAWAI

IPC分类号： H05K7/20

CPC分类号： H05K7/20409

摘要： An electronic control device capable of improving cooling performance by air cooling is provided.
The electronic control device includes a circuit board 6 (board), a heat-generating component 7 (heating element) mounted on the circuit board 6, a heat dissipation material 12 (thermally conductive material) that is in contact with the heat-generating component 7 and conducts heat of the heat-generating component 7, a fin-integrated housing 3 (housing) that is in contact with the heat dissipation material 12 and covers the circuit board 6, and a cover 1 that covers the fin-integrated housing 3. The cover 1 has a hole (2) 8 and a hole (3) 9 as intake holes, and a hole (1) 2 as an exhaust hole. The hole (1) 2 is formed at a position close to the heat-generating component 7 relative to the hole (2) 8 and the hole (3) 9. The hole (2) 8 and the hole (3) 9 are formed at positions away from the heat-generating component 7 relative to the hole (1) 2.