公开(公告)号：US10693233B2

公开(公告)日：2020-06-23

申请号：US16049104

申请日：2018-07-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Liangsheng Liu ,  Xinhong Li ,  HuiLi Fu

IPC: H01Q1/38 ,  H01Q9/04 ,  H01Q1/22 ,  H01Q21/06 ,  H01Q23/00 ,  H01Q21/00 ,  H01Q1/48

Abstract: A patch antenna unit and an antenna that relate to the field of communications technology wherein the patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.

公开(公告)号：US20180337456A1

公开(公告)日：2018-11-22

申请号：US16049104

申请日：2018-07-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Liangsheng Liu ,  Xinhong Li ,  HuiLi Fu

IPC: H01Q9/04 ,  H01Q1/48

Abstract: A patch antenna unit and an antenna that relate to the field of communications technology wherein the patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.