公开(公告)号：US10707143B2

公开(公告)日：2020-07-07

申请号：US15606355

申请日：2017-05-26

Applicant: Industrial Technology Research Institute

Inventor： Shu-Jung Yang ,  Yu-Lin Chao ,  Chun-Kai Liu ,  Ming Kaan Liang ,  Jiin Shing Perng

IPC: H01L23/36 ,  H01L23/373 ,  H01L25/065 ,  H01L23/427 ,  H01L25/11 ,  H01L25/07 ,  H01L23/31 ,  H01L23/467 ,  H01L23/367

Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.

公开(公告)号：US10051742B2

公开(公告)日：2018-08-14

申请号：US14964575

申请日：2015-12-10

Applicant: Industrial Technology Research Institute

Inventor： Shu-Jung Yang ,  Yu-Lin Chao ,  Heng-Chieh Chien ,  Chun-Kai Liu

IPC: H05K1/18 ,  H01L29/02 ,  H05K3/46

Abstract: A power module and a manufacturing method thereof are provided, and the power module includes a carrier substrate, an interconnection layer, a first chip, a second chip, a ceramic bonding substrate, a top interconnection layer and a lead frame. The interconnection layer is disposed on the carrier substrate. The first chip and the second chip are disposed on the interconnection layer, and electrically connected to the interconnection layer. The ceramic bonding substrate is disposed on the interconnection layer, and is disposed in between the first chip and the second chip so as to separate the first chip from the second chip. The top interconnection layer is disposed on the ceramic bonding substrate, covers the first chip and the second chip, and is electrically connected to the first chip and the second chip. The lead frame is disposed on the top interconnection layer and electrically connected to the top interconnection layer.

公开(公告)号：US20170345735A1

公开(公告)日：2017-11-30

申请号：US15606355

申请日：2017-05-26

Applicant: Industrial Technology Research Institute

Inventor： Shu-Jung Yang ,  Yu-Lin Chao ,  Chun-Kai Liu ,  Ming Kaan Liang ,  Jiin Shing Perng

IPC: H01L23/373 ,  H01L25/065 ,  H01L23/31 ,  H01L23/467 ,  H01L23/367

Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.

公开(公告)号：US20170171978A1

公开(公告)日：2017-06-15

申请号：US14964575

申请日：2015-12-10

Applicant: Industrial Technology Research Institute

Inventor： Shu-Jung Yang ,  Yu-Lin Chao ,  Heng-Chieh Chien ,  Chun-Kai Liu

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/185 ,  H01L29/02 ,  H05K1/186 ,  H05K3/4605 ,  H05K2201/10 ,  H05K2201/10166

Abstract: A power module and a manufacturing method thereof are provided, and the power module includes a carrier substrate, an interconnection layer, a first chip, a second chip, a ceramic bonding substrate, a top interconnection layer and a lead frame. The interconnection layer is disposed on the carrier substrate. The first chip and the second chip are disposed on the interconnection layer, and electrically connected to the interconnection layer. The ceramic bonding substrate is disposed on the interconnection layer, and is disposed in between the first chip and the second chip so as to separate the first chip from the second chip. The top interconnection layer is disposed on the ceramic bonding substrate, covers the first chip and the second chip, and is electrically connected to the first chip and the second chip. The lead frame is disposed on the top interconnection layer and electrically connected to the top interconnection layer.