公开(公告)号：US10726134B2

公开(公告)日：2020-07-28

申请号：US16103137

申请日：2018-08-14

Applicant: INTEL CORPORATION

Inventor： Shih-Han Wang ,  Yonghong Huang ,  Micah Sheller ,  Cory Cornelius

IPC: G06F21/57 ,  G06N5/04 ,  G06F21/56 ,  G06N20/00 ,  G06N3/08 ,  G06F21/55 ,  G06N3/00 ,  G06N3/04

Abstract: Embodiments discussed herein may be generally directed to systems and techniques to generate a quality score based on an observation and an action caused by an actor agent during a testing phase. Embodiments also include determining a temporal difference between the quality score and a previous quality score based on a previous observation and a previous action, determining whether the temporal difference exceeds a threshold value, and generating an attack indication in response to determining the temporal difference exceeds the threshold value.

公开(公告)号：US20190042979A1

公开(公告)日：2019-02-07

申请号：US16021704

申请日：2018-06-28

Applicant: Intel Corporation

Inventor： Raghuveer Devulapalli ,  Kelly Hammond ,  Yonghong Huang ,  Srinivas Pandruvada ,  Rahul Unnikrishnan Nair ,  Arjan Van De Ven ,  Denis Vladimirov ,  Qin Wang

IPC: G06N99/00 ,  G05B19/406

Abstract: An embodiment of a semiconductor package apparatus may include technology to learn thermal behavior information of a system based on input information including one or more of processor information, thermal information, and cooling information, and provide information to adjust one or more of a parameter of a processor and a parameter of a cooling subsystem based on the learned thermal behavior information and the input information. Other embodiments are disclosed and claimed.