公开(公告)号：US20190042979A1

公开(公告)日：2019-02-07

申请号：US16021704

申请日：2018-06-28

Applicant: Intel Corporation

Inventor： Raghuveer Devulapalli ,  Kelly Hammond ,  Yonghong Huang ,  Srinivas Pandruvada ,  Rahul Unnikrishnan Nair ,  Arjan Van De Ven ,  Denis Vladimirov ,  Qin Wang

IPC: G06N99/00 ,  G05B19/406

Abstract: An embodiment of a semiconductor package apparatus may include technology to learn thermal behavior information of a system based on input information including one or more of processor information, thermal information, and cooling information, and provide information to adjust one or more of a parameter of a processor and a parameter of a cooling subsystem based on the learned thermal behavior information and the input information. Other embodiments are disclosed and claimed.