公开(公告)号：US20190175107A1

公开(公告)日：2019-06-13

申请号：US16315593

申请日：2017-07-10

Applicant: INTERLINK ELECTRONICS, INC.

Inventor： Chee Wai LU ,  Cheng Seong LEE ,  Wai Jye CHAN ,  Kok Keong LAW

IPC: A61B5/00 ,  A61B5/103 ,  A61B5/0205 ,  A43B3/00 ,  A63B24/00

Abstract: An insole system includes a cushion layer configured to contact a human foot within an article of footwear and a sensing layer coupled to the cushion layer. The sensing layer may include a first sensing element and a second sensing element. The first sensing element and the second sensing element are one of: a force sensing element, a strain sensing element, or an environmental sensing element, wherein the first sensing element and the second sensing element are of a different type of sensing element. The insole system may also include a communications interface configured to couple the sensing layer with a host controller.