公开(公告)号：US20240088037A1

公开(公告)日：2024-03-14

申请号：US17931767

申请日：2022-09-13

Applicant: International Business Machines Corporation

Inventor： Brent A. Anderson ,  Nicholas Anthony Lanzillo ,  Ruilong Xie ,  Lawrence A. Clevenger ,  Albert M. Chu ,  Nicholas Alexander POLOMOFF

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/532

CPC classification number: H01L23/5286 ,  H01L21/76877 ,  H01L23/5283 ,  H01L23/53228

Abstract: A semiconductor device that includes a first via connecting a backside of the semiconductor device to a frontside of the semiconductor device, and a second via connecting the backside of the semiconductor device to the frontside of the semiconductor device. The first via and the second via are directly connected to at least one different wiring level on the frontside or the backside.