公开(公告)号：US20230244305A1

公开(公告)日：2023-08-03

申请号：US18150197

申请日：2023-01-05

Applicant: Industrial Technology Research Institute

Inventor： Te-Chih Liu ,  Ting-Hsun Cheng ,  Yu-Ju Chao ,  Jian-Lung Chen ,  Yu-Hsin Lin

IPC: G06F3/01 ,  G06T7/20 ,  G06T7/73 ,  G06V40/16 ,  G06V10/26 ,  G06V10/75

CPC classification number: G06F3/012 ,  G06T7/20 ,  G06T7/73 ,  G06V10/26 ,  G06V10/751 ,  G06V40/168 ,  G06V40/172 ,  G06T2207/20021 ,  G06T2207/30201 ,  G06V2201/02

Abstract: An active interactive navigation system includes a display device, a target object image capturing device, a user image capturing device, and a processing device. The target object image capturing device captures a dynamic object image. The user image capturing device obtains a user image. The processing device recognizes and selects a service user from the user image and captures a facial feature of the service user. If the facial feature matches facial feature points, the processing device detects a line of sight of the service user and accordingly recognizes a target object watched by the service user, generates face position three-dimensional coordinates corresponding to the service user, position three-dimensional coordinates corresponding to the target object, and depth and width information, accordingly calculates a cross-point position where the line of sight passes through the display device, and display virtual information of the target object on the cross-point position of the display device.

公开(公告)号：US11262482B2

公开(公告)日：2022-03-01

申请号：US16039336

申请日：2018-07-19

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Jui-Chang Chuang ,  Chen-Chu Tsai ,  Kai-Ming Chang ,  Chih-Chia Chang ,  Ting-Hsun Cheng

IPC: G02B1/14 ,  B32B7/12

Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

公开(公告)号：US20190049630A1

公开(公告)日：2019-02-14

申请号：US16039336

申请日：2018-07-19

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Jui-Chang Chuang ,  Chen-Chu Tsai ,  Kai-Ming Chang ,  Chih-Chia Chang ,  Ting-Hsun Cheng

IPC: G02B1/14 ,  B32B7/12

Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.