公开(公告)号：US20190246459A1

公开(公告)日：2019-08-08

申请号：US16251713

申请日：2019-01-18

Applicant: Infineon Technologies AG

Inventor： David Tumpold ,  Sebastian Anzinger ,  Christoph Glacer

IPC: H05B3/20 ,  G01N21/3504 ,  G01N21/17 ,  G01J3/10 ,  H05B3/03

CPC classification number: H05B3/20 ,  G01J3/108 ,  G01N21/1702 ,  G01N21/3504 ,  G01N2021/1704 ,  H05B3/03 ,  H05B2203/032

Abstract: An emitter structure includes a substrate with a membrane arrangement. The membrane arrangement includes at least one first membrane, a first heating path and a second heating path in different substrate planes. The first heating path and the second heating path are positioned with respect to one another such that a projection of the first heating path and a projection of the second heating path onto a common plane lie at least partly next to one another in the common plane.