公开(公告)号：US20190267336A1

公开(公告)日：2019-08-29

申请号：US16334965

申请日：2016-09-23

Applicant: Intel Corporation

Inventor： Digvijay Ashokkumar Raorane ,  Vijay K. Nair

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01Q1/22 ,  H05K1/18 ,  H05K1/02 ,  H05K3/46

Abstract: Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include a substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed on the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.