公开(公告)号：US09287208B1

公开(公告)日：2016-03-15

申请号：US14524622

申请日：2014-10-27

Applicant: Intel Corporation

Inventor： Surhud Khare ,  Ankit More ,  Dinesh Somasekhar ,  David S. Dunning

IPC: H01L25/00 ,  H01L23/522 ,  H01L23/528

CPC classification number: H04L49/109 ,  H01L23/5221 ,  H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，一种装置包括：配置在半导体管芯上的多个岛，多个岛中的每一个具有多个核; 以及多个网络交换机，其配置在所述半导体管芯上并且各自与所述多个岛中的一个岛相关联，其中每个网络交换机包括多个输出端口，所述输出端口的第一组各自耦合到相关联的网络交换机 经由点对点互连的岛屿和第二组输出端口各自经由点对多点互连耦合到多个岛的相关网络交换机。 描述和要求保护其他实施例。