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Patent Agency Ranking
公开(公告)号：US11798950B2
公开(公告)日：2023-10-24
申请号：US17119077
申请日：2020-12-11
Applicant: Japan Display Inc.
Inventor： Hiroshi Kawanago , Kazufumi Watabe
IPC: H01L27/12 , H10K59/12 , H10K77/10 , H10K102/00 , H10K50/00 , G02F1/1333 , G09F9/30 , H10K71/80
CPC classification number: H01L27/1218 , G02F1/133305 , G02F2202/28 , H01L27/1262 , H10K59/12 , H10K59/1201 , H10K71/80 , H10K77/111
Abstract: The purpose of the present invention is to prevent forming of soot like black substance on the back of the TFT substrate of resin during laser ablation to separate the glass substrate from the TFT substrate. The present invention takes the following structure to counter measure the above problem. A display device having pixels formed on a first surface of the resin substrate including: a first layer, formed from nitride, being formed on a second surface of the resin substrate, the second surface being an opposite surface to the first surface, in which a second layer, which is a separation layer, is formed on the first layer.
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公开(公告)号：US10886469B2
公开(公告)日：2021-01-05
申请号：US16701821
申请日：2019-12-03
Applicant: Japan Display Inc.
Inventor： Hiroshi Kawanago , Kazufumi Watabe
Abstract: A method of manufacturing a display device, including: a stacking step of stacking, on a glass substrate, a sacrificial resin layer, a metal layer, a transparent metal oxide layer, a base material resin layer, and a functional layer including at least one of a pixel circuit-constituting layer driving a plurality of pixels and a color filter layer, in this order; a radiating step of radiating a pulsed light of a xenon flash lamp to the metal layer through the glass substrate and the sacrificial resin layer; and a detaching step of reducing a force of adhesion between the sacrificial resin layer and the metal layer with the pulsed light radiated in the radiating step, and detaching the sacrificial resin layer from the metal layer.
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公开(公告)号：US09978989B2
公开(公告)日：2018-05-22
申请号：US15229629
申请日：2016-08-05
Applicant: Japan Display Inc.
Inventor： Kazufumi Watabe , Hiroshi Kawanago , Manabu Yamashita , Hideaki Ishige
CPC classification number: H01L51/5253 , H01L27/3244 , H01L51/003 , H01L51/5203 , H01L51/56 , H01L2227/323 , H01L2227/326 , H01L2251/566
Abstract: First rib layers made of an inorganic material are formed in first frame regions of a first glass substrate. First resin layers are formed in first product regions after the first rib layers are formed. First functional layers which include light emitting element layers as a result of luminance of each of unit pixels forming an image being controlled and sealing layers covering the light emitting element layers are formed on the first rib layers and the first resin layers. The first rib layers and the first functional layers are cut along lines passing through the first frame regions while avoiding the first product regions in order to separate the first product regions from each other. In the step of cutting the first rib layers and the first functional layers, the first rib layers and the sealing layers are cut.
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公开(公告)号：US09299760B2
公开(公告)日：2016-03-29
申请号：US14291103
申请日：2014-05-30
Applicant: Japan Display Inc.
Inventor： Kouhei Takahashi , Toshihiro Sato , Naohisa Ando , Hiroshi Kawanago
CPC classification number: H01L27/3276 , H01L2227/323 , H05K1/189 , H05K3/323 , H05K2201/10128
Abstract: A circuit unit is provided in which it is possible to connect circuit board to a terminal using a simple operation without removing a passivation film from above the terminal. A metal electrode which conducts with a circuit element is formed above a substrate. Multiple column shaped insulation films are each formed at a uniform pitch in two intersecting directions above the surface of the metal electrode. A metal electrode is formed above the metal electrode including the insulation film. A passivation film is formed on a surface of the metal electrode. Conductive beads are stuck between pairs of projection structured bodies formed on a surface of the passivation film, the passivation film on a side surface of the projection structure is scraped whereby the conductive beads conduct simultaneously with the metal electrode and an electrode formed on the circuit board.
Abstract translation: 提供一种电路单元，其中可以使用简单的操作将电路板连接到端子，而不从端子上方移除钝化膜。 与电路元件导通的金属电极形成在基板的上方。 多个柱状绝缘膜各自以均匀的间距在金属电极表面上的两个相交方向上形成。 在包括绝缘膜的金属电极上形成金属电极。 在金属电极的表面上形成钝化膜。 导电珠被粘附在形成在钝化膜的表面上的一对突起结构体之间，抛光突起结构的侧表面上的钝化膜被刮去，导电珠与金属电极和形成在电路板上的电极同时导电 。
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公开(公告)号：US09865817B2
公开(公告)日：2018-01-09
申请号：US15246707
申请日：2016-08-25
Applicant: Japan Display Inc.
Inventor： Hiroshi Kawanago , Kazufumi Watabe
CPC classification number: H01L51/003 , H01L27/322 , H01L27/3244 , H01L51/5284 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H05B33/0896 , H05B33/10 , H05B33/12
Abstract: A method of manufacturing a display device, including: a stacking step of stacking, on a glass substrate, a sacrificial resin layer, a metal layer, a transparent metal oxide layer, a base material resin layer, and a functional layer including at least one of a pixel circuit-constituting layer driving a plurality of pixels and a color filter layer, in this order; a radiating step of radiating a pulsed light of a xenon flash lamp to the metal layer through the glass substrate and the sacrificial resin layer; and a detaching step of reducing a force of adhesion between the sacrificial resin layer and the metal layer with the pulsed light radiated in the radiating step, and detaching the sacrificial resin layer from the metal layer.
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