Method for modeling interactions in multilayered electronic packaging
structures
    11.
    发明授权
    Method for modeling interactions in multilayered electronic packaging structures 失效
    多层电子封装结构中相互作用建模的方法

    公开(公告)号:US5504423A

    公开(公告)日:1996-04-02

    申请号:US333155

    申请日:1994-11-01

    申请人: Jiayuan Fang

    发明人: Jiayuan Fang

    IPC分类号: G01R29/08 G01R31/28 G01R31/02

    CPC分类号: G01R31/2801 G01R29/08

    摘要: A method for analyzing interactions between signal traces/vias and ground/power planes in multilayered electronic packaging structures is featured. The structure is provided with at least two, spaced-apart, conductive (generally metallic) planes, a conductive signal trace interposed between and coplanar with the spaced-apart conductive planes, and a via connected to the signal trace. Current that is assumed to be flowing in the via and signal trace is decomposed into two component currents called "modes". The first mode corresponds to a current which induces an electromagnetic field, resulting in an equal potential between the two conductive planes surrounding the signal trace. The second mode is the current which induces an electromagnetic field, resulting in a different voltage potential between the two surrounding conductive planes. The induced voltage in the signal trace/via due to the potential difference between conductive planes, together with the second mode via current that generates radial propagation of the potential difference between conductive planes efficiently and automatically accounts for all interactive effects of interplanar voltages and via/trace currents.

    摘要翻译: 特征在于分析多层电子封装结构中的信号迹线/通孔和地面/电源平面之间的相互作用的方法。 该结构设置有至少两个间隔开的导电(通常是金属的)平面,插入在间隔开的导电平面之间并与间隔开的导电平面共面的导电信号迹线,以及连接到信号迹线的通孔。 假设在通孔和信号迹线中流动的电流被分解成称为“模式”的两个分量电流。 第一模式对应于引起电磁场的电流,导致围绕信号迹线的两个导电平面之间具有相等的电位。 第二种模式是引起电磁场的电流,导致两个周围的导电平面之间的电压不同。 由于导电平面之间的电位差导致的信号迹线/通孔中的感应电压以及产生导电平面之间的电位差的径向传播的第二模式通过电流有效地自动地解决了面间电压和通孔/ 痕量电流。