公开(公告)号：US10815390B2

公开(公告)日：2020-10-27

申请号：US15996713

申请日：2018-06-04

Applicant: Kaneka Corporation ,  Japan Aerospace Exploration Agency

Inventor： Masahiko Miyauchi ,  Yuichi Ishida ,  Toshio Ogasawara ,  Rikio Yokota

IPC: C09D179/08 ,  C08G73/10 ,  C08L79/08 ,  C08J5/18 ,  C08J5/24 ,  B32B5/26 ,  B29C39/02 ,  B29C39/38 ,  B32B37/12 ,  B32B38/00 ,  B29K79/00 ,  B29L7/00

Abstract: An imide resin composition including a terminal-modified imide oligomer of General Formula (1) and a thermoplastic aromatic polyimide of General Formula (2). (In Formula (1), either R1 or R2 shows a phenyl group and the other shows a hydrogen atom; R3 and R4 show a divalent residue of aromatic diamine; R5 and R6 show a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m≥1, n≥0, 1≤m+n≤20, and 0.05≤m/(m+n)≤1; and an arrangement of repeating units may be either a block or random.) (In Formula (2), R1 and R2 show a divalent residue of aromatic diamine; R3 shows a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m≥1 and n≥0, and an arrangement of repeating units may be either a block or random.)

公开(公告)号：US10526450B2

公开(公告)日：2020-01-07

申请号：US16184176

申请日：2018-11-08

Applicant: KANEKA CORPORATION

Inventor： Takefumi Furuta ,  Masahiko Miyauchi ,  Rikio Yokota ,  Yuichi Ishida

IPC: C08G73/10 ,  C08J5/24 ,  C07D401/14 ,  C07D487/04 ,  C09D179/08 ,  C09D7/20

Abstract: A terminally modified imide oligomer is represented by a specific formula including a 2-phenyl-4,4′-diaminodiphenylether residue or a 4-phenoxy-1,3-diaminobenzene residue. A varnish is obtained by dissolving the terminally modified imide oligomer. A cured product is obtained by heat-curing the terminally modified imide oligomer, and a film including the cured product has a tensile elongation at break of 10% or more. An imide prepreg is obtained by impregnating fibers with the varnish and then drying the impregnated fibers. A fiber-reinforced composite material is obtained by layering and then heat-curing the imide prepreg.