公开(公告)号：US20240324461A1

公开(公告)日：2024-09-26

申请号：US18577769

申请日：2022-07-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Min LEE ,  Se Woon LEE ,  Man Hue CHOI ,  Hyung Eui LEE

IPC: H10N10/17

CPC classification number: H10N10/17

Abstract: A thermoelectric device according to an embodiment of the present invention comprises: a support which includes a first groove and a second groove arranged at one surface thereof to be spaced apart from each other; a thermoelectric module which is disposed on one surface of the support between the first groove and the second groove; and a first sealing member and a second sealing member which are disposed in the first groove and the second groove respectively and are spaced apart from the thermoelectric module.

公开(公告)号：US20230075288A1

公开(公告)日：2023-03-09

申请号：US17792321

申请日：2021-01-11

Applicant: LG INNOTEK CO., LTD.

Inventor： Jung Ho KIM ,  Jeung Ook PARK ,  Sang Hun AN ,  Jong Min LEE ,  Ji Hwan JEON

IPC: H01L35/32 ,  H01L35/30 ,  H01L35/04

Abstract: A power generation apparatus according to an embodiment of the present invention comprises: a cooling unit, a thermoelectric module comprising a thermoelectric element disposed on one surface of the cooling unit, and a heat sink disposed on the thermoelectric element; a guide plate disposed opposite the thermoelectric module; and a branch unit disposed on another surface perpendicular to the one surface of the cooling unit. The heat sink includes multiple heat dissipation fins which are spaced apart from each other. The ratio of the shortest horizontal distance between the heat sink and the guide plate to the shortest horizontal distance between the branch unit and the guide plate is 0.0625 to 0.25.

公开(公告)号：US20210143308A1

公开(公告)日：2021-05-13

申请号：US17088880

申请日：2020-11-04

Applicant: LG INNOTEK CO., LTD.

Inventor： Man Hue CHOI ,  Sue Kyung OH ,  Jong Min LEE

IPC: H01L35/32

Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first metal substrate including a first through-hole formed therein, a first insulating layer disposed on the first metal substrate and including a second through-hole formed at a position corresponding to the first through-hole, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a semiconductor structure disposed on the first electrode part, a second electrode part disposed on the semiconductor structure and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer, wherein the first metal substrate includes a first outer periphery, a second outer periphery, a third outer periphery, and a fourth outer periphery which define a shape of the first metal substrate, the first outer periphery and the fourth outer periphery are opposite to each other, the second outer periphery and the third outer periphery are opposite to each other between the first outer periphery and the fourth outer periphery, the first electrode part includes a first region vertically overlapping the plurality of second electrodes, at least one of the plurality of first electrodes includes an extension portion extending toward the first outer periphery from the first region, the first through-hole is formed in an inside of the first region, and a shortest distance between the second outer periphery and a first electrode, which is closest to the second through-hole among the plurality of first electrodes, is within ±10% of a shortest distance between the second outer periphery and the extension portion.

公开(公告)号：US20200321505A1

公开(公告)日：2020-10-08

申请号：US16766856

申请日：2018-11-19

Applicant: LG INNOTEK CO., LTD

Inventor： Jong Min LEE ,  Yong Sang CHO ,  Jong Hyun KANG

IPC: H01L35/32

Abstract: Disclosed is an embodiment is a thermoelectric module comprising: a first thermally conductive plate; a thermoelectric element arranged on the first thermally conductive plate; a second thermally conductive plate arranged on the thermoelectric element; and a cover frame, which is arranged on the first thermally conductive plate, and has an accommodation space such that the thermoelectric element is accommodated in the accommodation space, wherein the thermoelectric element includes: a first substrate; a plurality of thermoelectric legs arranged on the first substrate; a second substrate arranged on the plurality of thermoelectric legs; and electrodes comprising a plurality of first electrodes arranged between the first substrate and the plurality of thermoelectric legs; and a plurality of second electrodes arranged between the second substrate and the plurality of thermoelectric legs, and the cover frame includes: an outer frame arranged to be spaced from the thermoelectric element on the first thermally conductive plate; and an upper frame extending toward the second thermally conductive plate so as to be inclined from the upper end of the outer frame toward the downward direction thereof.