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    THERMOELECTRIC MODULE AND HEAT CONVERSION DEVICE USING THE SAME
    11.
    发明申请
    THERMOELECTRIC MODULE AND HEAT CONVERSION DEVICE USING THE SAME 有权
    使用相同的热电模块和热转换装置

    公开(公告)号：US20150194589A1

    公开(公告)日：2015-07-09

    申请号：US14591226

    申请日：2015-01-07

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Myoung Lae ROH

    IPC: H01L35/32

    CPC classification number: H01L35/32

    Abstract: Provided is a thermoelectric module capable of preventing the leakage of a current generated from a connection portion upon connecting a thermoelectric semiconductor element to an electrode by forming an insulating layer having a low heat conductivity on an external surface of the thermoelectric semiconductor element and improving performance of the thermoelectric element by controlling a heat transfer phenomenon from a heating part to a cooling part.

    Abstract translation: 提供了一种热电模块，其能够通过在热电半导体元件的外表面上形成具有低导热性的绝缘层将热电半导体元件连接到电极，从而防止从连接部分产生的电流泄漏， 该热电元件通过控制从加热部到冷却部的传热现象。

    THERMOELECTRIC MODULE AND POWER GENERATING APPARATUS COMPRISING SAME
    13.
    发明公开
    THERMOELECTRIC MODULE AND POWER GENERATING APPARATUS COMPRISING SAME 审中-公开

    公开(公告)号：US20240032428A1

    公开(公告)日：2024-01-25

    申请号：US18024798

    申请日：2021-09-07

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Myoung Lae ROH

    IPC: H10N10/817 ,  H10N10/17

    CPC classification number: H10N10/817 ,  H10N10/17

    Abstract: According to an embodiment, a thermoelectric module is disclosed, the thermoelectric module comprising: a first heat-conducting member; a second heat-conducting member; a thermoelectric element disposed between the first heat-conducting member and the second heat-conducting member; a first sealing member disposed outside the thermoelectric element; and a second sealing member disposed outside the first sealing member, wherein the thermoelectric element includes a first substrate, a second substrate facing the first substrate, and a semiconductor structure disposed between the first substrate and the second substrate, and the first sealing member is disposed between the upper surface of the first substrate and the lower surface of the second substrate, and includes a convex side surface toward the semiconductor structure, and the second sealing member is in contact with the side surface of the first substrate and the side surface of the second substrate, and includes a gap between the second sealing member and the convex side surface of the first sealing member.

    THERMOELECTRIC MODULE
    14.
    发明公开
    THERMOELECTRIC MODULE 审中-公开

    公开(公告)号：US20230354708A1

    公开(公告)日：2023-11-02

    申请号：US18041417

    申请日：2021-08-11

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Sue Kyung OH ,  Myoung Lae ROH ,  Seung Yong LEE

    IPC: H10N10/13 ,  H10N10/17

    CPC classification number: H10N10/13 ,  H10N10/17

    Abstract: Disclosed according to an embodiment is a thermoelectric module comprising: a first heat-conducting member including a first recess; a second heat-conducting member spaced apart from the first heat-conducting member; a thermoelectric element disposed between the first heat-conducting member and the second heat-conducting member; and a circuit unit electrically connected to the thermoelectric element to control resistance, wherein the circuit unit is disposed in the first recess.

    THERMOELECTRIC ELEMENT
    15.
    发明公开
    THERMOELECTRIC ELEMENT 审中-公开

    公开(公告)号：US20230345835A1

    公开(公告)日：2023-10-26

    申请号：US18027180

    申请日：2021-09-17

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Myoung Lae ROH ,  Tae Su YANG

    IPC: H10N10/817

    CPC classification number: H10N10/817

    Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first electrode; a semiconductor structure disposed on the first electrode; and a second electrode disposed on the semiconductor structure, wherein the bottom surface of the second electrode includes an overlap area vertically overlapping the first electrode, the semiconductor structure includes a top surface opposite to the second electrode, and the center of the top surface of the semiconductor structure is arranged to be offset from the center of the overlap area.

    THERMOELECTRIC MODULE
    16.
    发明申请
    THERMOELECTRIC MODULE 有权

    公开(公告)号：US20220140220A1

    公开(公告)日：2022-05-05

    申请号：US17431783

    申请日：2020-02-26

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jong Hyun KIM ,  Myoung Lae ROH

    IPC: H01L35/32 ,  H01L35/30 ,  H01L35/10

    Abstract: A thermoelectric module according to an embodiment of the present invention comprises: a housing, a thermoelectric element accommodated in the housing; a sealing member disposed on a side portion of the thermoelectric element; and a heat transfer member disposed on the thermoelectric element. The thermoelectric element includes: a first substrate; a plurality of first electrodes disposed on the first substrate; a plurality of thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of thermoelectric legs; and a second substrate disposed on the second electrodes. The heat transfer member includes a plurality of grooves, and the sealing member is in contact with a side surface of at least one of the first electrodes, the second electrodes, and the plurality of thermoelectric legs.

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