公开(公告)号：US20230263059A1

公开(公告)日：2023-08-17

申请号：US18010584

申请日：2021-07-22

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Hyun KIM ,  Young Sam YOO ,  Yong Sang CHO

IPC: H10N10/13 ,  H10N10/81 ,  H10N10/17

CPC classification number: H10N10/13 ,  H10N10/81 ,  H10N10/17

Abstract: A thermoelectric module according to an embodiment of the present invention comprises: a first substrate; a first electrode disposed on the first substrate; a semiconductor structure disposed on the first electrode; a second electrode disposed on the semiconductor structure; a second substrate disposed on the second electrode; and a heat sink disposed on the second substrate, wherein the heat sink includes a protrusion portion disposed on at least one surface of a path through which a fluid passes.

公开(公告)号：US20140092199A1

公开(公告)日：2014-04-03

申请号：US14040184

申请日：2013-09-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Min Soo KIM ,  Jong Hyun KIM

IPC: H04N7/15 ,  H04N13/02

CPC classification number: H04N7/15 ,  H04N5/2251 ,  H04N5/23241 ,  H04N5/64 ,  H04N7/142 ,  H04N13/243 ,  H04N13/254 ,  H04N13/271 ,  H04N21/4223 ,  H04N21/4424 ,  H04N21/4788 ,  H04N21/816

Abstract: A TV apparatus according to an exemplary embodiment of the present disclosure includes a TV body configured to display an image, and a camera module configured to be driven, in a case the TV body is protruded.

Abstract translation: 根据本公开的示例性实施例的电视设备包括被配置为显示图像的电视机体和被配置为被驱动的相机模块，在电视机体突出的情况下。

公开(公告)号：US20240397824A1

公开(公告)日：2024-11-28

申请号：US18729256

申请日：2023-02-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Hyun KIM

IPC: H10N10/13 ,  H10N10/17

Abstract: A thermoelectric module according to one embodiment of the present invention comprises: a first substrate; a first electrode disposed on the first substrate; a semiconductor structure disposed on the first electrode; a second electrode disposed on the semiconductor structure; a second substrate disposed on the second electrode; and a heat sink disposed on the second substrate, wherein the heat sink includes, on the surface thereof, a plurality of grooves extending in a first direction through which fluid passes, the plurality of grooves have the same first width in the direction parallel to the surface of the heat sink and perpendicular to the first direction and have the same depth in the direction perpendicular to the surface of the heat sink, and the first width is 1 to 10 μm and the depth is 1 to 10 μm.

公开(公告)号：US20220140220A1

公开(公告)日：2022-05-05

申请号：US17431783

申请日：2020-02-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Hyun KIM ,  Myoung Lae ROH

IPC: H01L35/32 ,  H01L35/30 ,  H01L35/10

Abstract: A thermoelectric module according to an embodiment of the present invention comprises: a housing, a thermoelectric element accommodated in the housing; a sealing member disposed on a side portion of the thermoelectric element; and a heat transfer member disposed on the thermoelectric element. The thermoelectric element includes: a first substrate; a plurality of first electrodes disposed on the first substrate; a plurality of thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of thermoelectric legs; and a second substrate disposed on the second electrodes. The heat transfer member includes a plurality of grooves, and the sealing member is in contact with a side surface of at least one of the first electrodes, the second electrodes, and the plurality of thermoelectric legs.

公开(公告)号：US20210066566A1

公开(公告)日：2021-03-04

申请号：US16644799

申请日：2018-09-18

Applicant: LG INNOTEK CO., LTD.

Inventor： Hee Yol JIN ,  Jong Hyun KIM ,  Tae Su YANG ,  Young Sam YOO ,  Gu LEE ,  Youn Gyo LEE ,  Kye Soo JUN

IPC: H01L35/08 ,  H01L35/32

Abstract: A thermoelectric device according to one embodiment of the present invention comprises: a first substrate; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately disposed on the first substrate; a second substrate disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a plurality of first electrodes disposed between the first substrate and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and respectively having a P-type thermoelectric leg and N-type thermoelectric leg pair disposed therein; and a plurality of second electrodes disposed between the second substrate and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and respectively having a P-type thermoelectric leg and N-type thermoelectric leg pair disposed therein, wherein a P-type solder layer and N-type solder layer pair and a barrier layer disposed between the P-type solder layer and N-type solder layer pair are disposed on each of the plurality of first electrodes, and a P-type solder layer and N-type solder layer pair and a barrier layer disposed between the P-type solder layer and N-type solder layer pair are disposed on each of the plurality of second electrodes.

公开(公告)号：US20230165147A1

公开(公告)日：2023-05-25

申请号：US17916210

申请日：2021-03-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Se Woon LEE ,  Jong Hyun KIM ,  Young Sam YOO

IPC: H10N10/817 ,  H10N10/17

CPC classification number: H10N10/817 ,  H10N10/17

Abstract: Provided according to an embodiment is a thermoelectric element comprising: a first insulating part; multiple first electrodes disposed on the first insulating part; a second electrode disposed above the first electrodes; a first conductive semiconductor structure and a second conductive semiconductor structure disposed while being spaced each other between the first electrodes and the second electrode; and a second insulating part disposed on the second electrode, wherein the first insulating part comprises first protrusions protruding toward the first electrodes, and the second insulating part comprises a second protrusion protruding toward the second electrode.

公开(公告)号：US20230124140A1

公开(公告)日：2023-04-20

申请号：US17913982

申请日：2021-03-02

Applicant: LG INNOTEK CO., LTD.

Inventor： Se Woon LEE ,  Jong Hyun KIM ,  Young Sam YOO

IPC: H10N10/17

Abstract: According to an embodiment, disclosed is a thermoelectric device comprising: a thermoelectric element comprising a first substrate, a plurality of first electrodes disposed on the first substrate, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes, a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and a second substrate disposed on the plurality of second electrodes; and a heat sink comprising a plurality of fins disposed to be spaced apart on the second substrate, wherein the second substrate comprises a first region overlapping the second electrodes in a vertical direction and a second region not overlapping the second electrodes in the vertical direction, and wherein separation distances between adjacent fins of the plurality of fins are different from each other in the first region and the second region.

公开(公告)号：US20220320409A1

公开(公告)日：2022-10-06

申请号：US17640019

申请日：2020-09-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Hyun KIM ,  Young Sam YOO ,  Se Woon LEE

IPC: H01L35/32

Abstract: Provided is a thermoelectric module. The thermoelectric module includes a thermoelectric element including a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode, a heat sink disposed on the second substrate, and an adhesive layer configured to bond the second substrate to the heat sink. The heat sink has a shape in which predetermined patterns are regularly repeated and connected. Each pattern includes a first surface disposed opposite to the second substrate, a in second surface which extends upward from one end of the first surface, a third surface which extends from the second surface to face the second substrate, and a fourth surface which extends upward from the other end opposite to the one end of the first surface and is connected to a third surface of an adjacent pattern. A distance between the third surface and the second substrate is greater than a distance between the first surface and the second substrate, and the adhesive layer is disposed between the second substrate and the first surface.