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公开(公告)号：US11253708B2
公开(公告)日：2022-02-22
申请号：US16413457
申请日：2019-05-15
Applicant: MEDTRONIC, INC.
Inventor： Michael J. Baade , Steven T. Deininger , Katherine J. Bach
Abstract: Implantable medical devices include an enclosure that is constructed by machining of a material rather than by forming or stamping. The machining produces one or more internal features within the enclosure. These internal features may include shelves that may act as a stiffener and create separate compartments within the enclosure. These internal features may include contoured edges along the shelves to accommodate conductors and other structures that extend from one compartment to another. These features may include slots that are present in one or more locations, such as on a surface of one of the shelves. These internal features may also include standoffs that establish a gap between an internal component and the external wall of the enclosure. These internal features may also include different thicknesses in different areas of the enclosure, such as one wall thickness in one compartment and a different wall thickness in another compartment.
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公开(公告)号：US10828127B2
公开(公告)日：2020-11-10
申请号：US15650665
申请日：2017-07-14
Applicant: MEDTRONIC, INC.
Inventor： Steven T. Deininger , Michael J. Baade , Charles E. Peters
Abstract: Enclosures for implantable medical devices are machined from biocompatible materials using processes such as electric discharge machining and/or milling. Material is machined to create an enclosure. The enclosure may include an enclosure sleeve that has top and bottom caps added where the enclosure sleeve is machined either as a whole or as two separate halves that are subsequently joined together. During construction, circuitry is installed and where the enclosure includes an enclosure sleeve, the open top and bottom may be closed by caps while a connector block module may be mounted to the complete enclosure. The machining process allows materials that are typically difficult to stamp, such as grade 5 and 9 titanium and 811 titanium, that are beneficial to telemetry and recharging features of an implantable medical device to be used while allowing for an enclosure with a relatively detailed geometry and relatively tight tolerances.
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13.发明授权公开(公告)号：US10646719B2
公开(公告)日：2020-05-12
申请号：US16543496
申请日：2019-08-16
Applicant: MEDTRONIC, INC.
Inventor： Steven T. Deininger , Michael J. Baade , Katherine J. Bach , Van L. Snyder
Abstract: Connector enclosure assemblies for medical devices provide an angled lead passageway. The lead passageway which is defined by electrical connectors and intervening seals within the connector enclosure assembly establishes the angle relative to a base plane of the connector enclosure assembly. Various other aspects may be included in conjunction with the angled lead passageway, including an angled housing of the connector enclosure assembly, feedthrough pins that extend to the electrical connectors where the feedthrough pins may include angled sections, and a set screw passageway set at an angle relative to the lead passageway to provide fixation of a lead within the lead passageway.
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14.发明申请公开(公告)号：US20190314634A1
公开(公告)日：2019-10-17
申请号：US16393288
申请日：2019-04-24
Applicant: MEDTRONIC, INC.
Inventor： Steven T. Deininger , Michael J. Baade , Katherine J. Bach , Van L. Snyder
Abstract: Connector enclosure assemblies for medical devices provide an angled lead passageway. The lead passageway which is defined by electrical connectors and intervening seals within the connector enclosure assembly establishes the angle relative to a base plane of the connector enclosure assembly. Various other aspects may be included in conjunction with the angled lead passageway, including an angled housing of the connector enclosure assembly, feedthrough pins that extend to the electrical connectors where the feedthrough pins may include angled sections, and a set screw passageway set at an angle relative to the lead passageway to provide fixation of a lead within the lead passageway.
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公开(公告)号：US10300291B2
公开(公告)日：2019-05-28
申请号：US16173309
申请日：2018-10-29
Applicant: MEDTRONIC, INC.
Inventor： Michael J. Baade , Katherine J. Bach , Steven T. Deininger
IPC: A61N1/375
Abstract: Implantable medical devices include header structures with conductive paths from the feedthrough conductors that may be located on one side of the device to electrical connectors that may be located on an opposite side of the device. The conductive paths may include conductive interconnect pins and lead frame conductors. The conductive interconnect pins may be located in holes present in a header body where the conductive interconnect pins are attached to the feedthrough conductors on one end and are attached to the lead frame conductors on the opposite end. The lead frame conductors then extend to the corresponding electrical connectors. The header body may provide cavities on each side to allow for the insertion of stack assemblies that include the electrical connectors and lead frame conductors.
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Patent Agency Ranking
公开(公告)号：US20190060653A1
公开(公告)日：2019-02-28
申请号：US16173309
申请日：2018-10-29
Applicant: MEDTRONIC, INC.
Inventor： Michael J. Baade , Katherine J. Bach , Steven T. Deininger
IPC: A61N1/375
Abstract: Implantable medical devices include header structures with conductive paths from the feedthrough conductors that may be located on one side of the device to electrical connectors that may be located on an opposite side of the device. The conductive paths may include conductive interconnect pins and lead frame conductors. The conductive interconnect pins may be located in holes present in a header body where the conductive interconnect pins are attached to the feedthrough conductors on one end and are attached to the lead frame conductors on the opposite end. The lead frame conductors then extend to the corresponding electrical connectors. The header body may provide cavities on each side to allow for the insertion of stack assemblies that include the electrical connectors and lead frame conductors.
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公开(公告)号：US09393431B2
公开(公告)日：2016-07-19
申请号：US14865458
申请日：2015-09-25
Applicant: MEDTRONIC, INC.
Inventor： Steven T. Deininger , Jeffrey J. Clayton , Charles E. Peters
CPC classification number: A61N1/3752 , A61N1/3718 , B23K26/24 , B23K26/32 , B23K2101/36 , B23K2103/14 , Y10T29/49117
Abstract: Medical devices provide metallic connector enclosures. The metallic connector enclosures may be constructed with relatively thin walls in comparison to polymer connector enclosures to aid in miniaturizing the medical device. The metallic connector enclosures may be constructed with interior surfaces that deviate less from an ideal inner surface shape in comparison to polymer connector enclosures to allow for better concentricity of electrical connectors. The metallic connector enclosures may include a panel that allows access to the cavity of the connector enclosure where set screw blocks, lead connectors, spacers, seals, and the like may be located. Furthermore, the lead connectors within the metallic connector enclosures may be separated from the metallic connector enclosure by being positioned within non-conductive seals that reside within features included in cavity walls of the connector enclosure. Similarly, set screw blocks may be separated from the metallic connector enclosure by non-conductive spacers present within the cavity.
Abstract translation: 医疗设备提供金属连接器外壳。 与聚合物连接器外壳相比，金属连接器外壳可以被构造成具有相对较薄的壁，以有助于使医疗装置小型化。 与聚合物连接器外壳相比，金属连接器外壳可以构造为具有偏离理想内表面形状的内表面，以允许电连接器更好的同心度。 金属连接器外壳可以包括允许进入连接器外壳的空腔的面板，其中固定螺丝块，引线连接器，间隔件，密封件等可以位于其中。 此外，金属连接器外壳内的引线连接器可以通过位于连接器外壳的空腔壁内的特征内的非导电密封件内而与金属连接器外壳分离。 类似地，固定螺钉块可以通过在腔内存在的非导电间隔件与金属连接器外壳分离。
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公开(公告)号：US12017079B2
公开(公告)日：2024-06-25
申请号：US17674195
申请日：2022-02-17
Applicant: MEDTRONIC, INC.
Inventor： Michael J. Baade , Steven T. Deininger , Katherine J. Bach
CPC classification number: A61N1/375 , A61N1/37223 , A61N1/3787
Abstract: Implantable medical devices include an enclosure that is constructed by machining of a material rather than by forming or stamping. The machining produces one or more internal features within the enclosure. These internal features may include shelves that may act as a stiffener and create separate compartments within the enclosure. These internal features may include contoured edges along the shelves to accommodate conductors and other structures that extend from one compartment to another. These features may include slots that are present in one or more locations, such as on a surface of one of the shelves. These internal features may also include standoffs that establish a gap between an internal component and the external wall of the enclosure. These internal features may also include different thicknesses in different areas of the enclosure, such as one wall thickness in one compartment and a different wall thickness in another compartment.
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公开(公告)号：US20220008735A1
公开(公告)日：2022-01-13
申请号：US17487291
申请日：2021-09-28
Applicant: MEDTRONIC, INC.
Inventor： Steven T. Deininger , Jeffrey J. Clayton , Charles E. Peters
Abstract: Medical devices provide metallic connector enclosures. The metallic connector enclosures may be constructed with relatively thin walls in comparison to polymer connector enclosures to aid in miniaturizing the medical device. The metallic connector enclosures may be constructed with interior surfaces that deviate less from an ideal inner surface shape in comparison to polymer connector enclosures to allow for better concentricity of electrical connectors. The metallic connector enclosures may include a panel that allows access to the cavity of the connector enclosure where set screw blocks, lead connectors, spacers, seals, and the like may be located. Furthermore, the lead connectors within the metallic connector enclosures may be separated from the metallic connector enclosure by being positioned within non-conductive seals that reside within features included in cavity walls of the connector enclosure. Similarly, set screw blocks may be separated from the metallic connector enclosure by non-conductive spacers present within the cavity.
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公开(公告)号：US20210339027A1
公开(公告)日：2021-11-04
申请号：US17377675
申请日：2021-07-16
Applicant: MEDTRONIC, INC.
Inventor： Steven T. Deininger , Michael J. Baade , Charles E. Peters
Abstract: An implantable medical device includes an enclosure sleeve and a top cap. The enclosure sleeve comprises an enclosure wall with at least a portion of the enclosure wall comprising the grade 5 titanium and having a thickness between 0.007 inches and 0.009 inches. The enclosure sleeve includes an open top end and an open bottom end that is opposite the open top end. The top cap includes a feedthrough block, a first top cap end portion, and a second top cap end portion. The first top cap end portion is configured to couple to the open top end of the enclosure sleeve, and the second top cap end portion configured to be positioned within the enclosure sleeve.
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