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    Wafer structure
    11.
    发明授权
    Wafer structure 有权

    公开(公告)号：US11639054B2

    公开(公告)日：2023-05-02

    申请号：US17116292

    申请日：2020-12-09

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Hao-Jan Mou ,  Ying-Lun Chang ,  Hsien-Chung Tai ,  Chi-Feng Huang ,  Yung-Lung Han

    IPC: B41J2/14 ,  B41J2/16

    Abstract: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate.

    Micro-electromechanical system pump
    12.
    发明授权
    Micro-electromechanical system pump 有权

    公开(公告)号：US11536260B2

    公开(公告)日：2022-12-27

    申请号：US16570352

    申请日：2019-09-13

    Applicant: MICROJET TECHNOLOGY CO., LTD.

    Inventor： Hao-Jan Mou ,  Rong-Ho Yu ,  Cheng-Ming Chang ,  Hsien-Chung Tai ,  Wen-Hsiung Liao ,  Chi-Feng Huang ,  Yung-Lung Han ,  Chang-Yen Tsai

    IPC: F04B43/04 ,  H01L41/083

    Abstract: A MEMS pump includes a first substrate, a first oxide layer, a second substrate, a second oxide layer, a third substrate and a piezoelectric element sequentially stacked to form the entire structure of the MEMS pump. The first substrate has a first thickness and at least one inlet aperture. The first oxide layer has at least one fluid inlet channel and a convergence chamber, wherein the fluid inlet channel communicates with the convergence chamber and the inlet aperture. The second substrate has a second thickness and a through hole, and the through hole is misaligned with the inlet aperture and communicates with the convergence chamber. The second oxide layer has a first chamber with a concave central portion. The third substrate has a third thickness and a plurality of gas flow channels, wherein the gas flow channels are misaligned with the through hole.

    WAFER STRUCTURE
    13.
    发明申请
    WAFER STRUCTURE 有权

    公开(公告)号：US20220219456A1

    公开(公告)日：2022-07-14

    申请号：US17530066

    申请日：2021-11-18

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Hao-Jan Mou ,  Ying-Lun Chang ,  Hsien-Chung Tai ,  Yung-Lung Han ,  Chi-Feng Huang ,  Chin-Wen Hsieh

    IPC: B41J2/16 ,  B41J2/14

    Abstract: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process. At least one inkjet chip is directly formed on the chip substrate by the semiconductor process and diced into the at least one inkjet chip for inkjet printing. Each of the inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.

    WAFER STRUCTURE
    14.
    发明申请
    WAFER STRUCTURE 有权

    公开(公告)号：US20220161558A1

    公开(公告)日：2022-05-26

    申请号：US17410779

    申请日：2021-08-24

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Hao-Jan Mou ,  Ying-Lun Chang ,  Hsien-Chung Tai ,  Yung-Lung Han ,  Chi-Feng Huang ,  Chang-Yen Tsai

    IPC: B41J2/14 ,  B41J2/145

    Abstract: A wafer structure including a chip substrate and plural inkjet chips is disclosed. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chips are formed on the chip substrate by the semiconductor process and diced into the first inkjet chip and the second inkjet chip. Each of the first inkjet chip and the second inkjet chip includes plural ink-drop generators. Each of the ink-drop generators includes a nozzle. A diameter of the nozzle is in a range between 0.5 micrometers and 10 micrometers. A volume of an inkjet drop discharged from the nozzle is in a range between 1 femtoliter and 3 picoliters. The ink-drop generators form plural longitudinal axis array groups having a pitch and form plural horizontal axis array groups having a central stepped pitch equal to 1/600 inches or less.

    MANUFACTURING METHOD OF MINIATURE FLUID ACTUATOR
    17.
    发明申请
    MANUFACTURING METHOD OF MINIATURE FLUID ACTUATOR 有权

    公开(公告)号：US20210147221A1

    公开(公告)日：2021-05-20

    申请号：US17072863

    申请日：2020-10-16

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Hao-Jan Mou ,  Hsien-Chung Tai ,  Lin-Huei Fang ,  Yung-Lung Han ,  Chi-Feng Huang ,  Chang-Yen Tsai ,  Wei-Ming Lee

    IPC: B81C1/00 ,  F04B43/04 ,  H01L41/331 ,  H01L41/332 ,  H01L41/297

    Abstract: A manufacturing method of miniature fluid actuator is disclosed and includes the following steps. A flow-channel main body manufactured by a CMOS process is provided, and an actuating unit is formed by a deposition process, a photolithography process and an etching process. Then, at least one flow channel is formed by etching, and a vibration layer and a central through hole are formed by a photolithography process and an etching process. After that, an orifice layer is provided to form at least one outflow opening by an etching process, and then a chamber is formed by rolling a dry film material on the orifice layer. Finally, the orifice layer and the flow-channel main body are flip-chip aligned and hot-pressed, and then the miniature fluid actuator is obtained by a flip-chip alignment process and a hot pressing process.

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