公开(公告)号：US20140287558A1

公开(公告)日：2014-09-25

申请号：US14300130

申请日：2014-06-09

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Steven Eskildsen ,  Aravind Ramamoorthy

IPC: H01L21/56 ,  H01L23/00

CPC classification number: H01L21/561 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49531 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having an interposer including at least one topological feature, such as a depression in a surface of the interposer, a die coupled to the surface of the interposer, and an encapsulant material formed over the die and the interposer, and disposed in the at least one depression to resist movement of the encapsulant material relative to the interposer. Other embodiments may be described and claimed.

Abstract translation: 实施例包括但不限于包括半导体封装的设备和系统。 具有包括至少一个拓扑特征（例如插入件的表面中的凹陷）的插入件的存储器封装，耦合到插入件的表面的管芯，以及形成在管芯和插入件上的密封剂材料，并且设置在 至少一个凹陷以抵抗密封材料相对于插入件的移动。 可以描述和要求保护其他实施例。