公开(公告)号：US20210384159A1

公开(公告)日：2021-12-09

申请号：US16892084

申请日：2020-06-03

Applicant: Micron Technology, Inc.

Inventor： Yeongbeom Ko ,  Youngik Kwon ,  Jungbae Lee

IPC: H01L25/065 ,  H01L23/552 ,  H01L25/18 ,  H01L25/00 ,  H01L21/56

Abstract: This patent application relates to microelectronic device packages with internal EMI shielding, methods of fabricating and related electronic systems. One or more microelectronic devices of a package including multiple microelectronic devices are EMI shielded, and one or more other microelectronic devices of the package are located outside the EMI shielding.

公开(公告)号：US20210143073A1

公开(公告)日：2021-05-13

申请号：US16681214

申请日：2019-11-12

Applicant: Micron Technology, Inc.

Inventor： Youngik Kwon ,  Jong Sik Paek

IPC: H01L23/31 ,  H01L21/56

Abstract: A mold chase for packaging a compartmentally shielded multifunctional semiconductor is provided. The mold chase generally includes a first cavity and a second cavity separated by a trench plate positioned between a first component and a second component of the multifunctional semiconductor between which a compartmental shield is required. The mold chase is lowered into a molding position over the multifunctional semiconductor and a molding material is injected through an inlet sprue into the first and second cavities to surround the first and second components, respectively. After the molding material is cured, the mold chase is removed and an open trench is formed in the cured molding material by the trench plate. The open trench is filled with a conductive material to form the compartmental shield. A conformal shield may be added to cover the package.