MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20190228900A1

    公开(公告)日:2019-07-25

    申请号:US16374769

    申请日:2019-04-04

    Inventor: Kanto IIDA

    Abstract: A multilayer board includes a first substrate made of a thermoplastic resin, a first conductor pattern provided on the first substrate, a second substrate made of the thermoplastic resin, and a second conductor pattern provided on the second substrate. An insulation coating which covers the first conductor pattern is partially disposed between the first substrate and the second substrate. The insulation coating is made of a material having lower fluidity at a predetermined press temperature than fluidities of the first substrate and the second substrate, and a plurality of substrates including the first substrate and the second substrate are laminated and thermally compressed and bonded at the press temperature.

    SIGNAL TRANSMISSION LINE
    13.
    发明申请

    公开(公告)号:US20180309182A1

    公开(公告)日:2018-10-25

    申请号:US16022761

    申请日:2018-06-29

    Abstract: A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

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