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公开(公告)号:US20190228900A1
公开(公告)日:2019-07-25
申请号:US16374769
申请日:2019-04-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kanto IIDA
Abstract: A multilayer board includes a first substrate made of a thermoplastic resin, a first conductor pattern provided on the first substrate, a second substrate made of the thermoplastic resin, and a second conductor pattern provided on the second substrate. An insulation coating which covers the first conductor pattern is partially disposed between the first substrate and the second substrate. The insulation coating is made of a material having lower fluidity at a predetermined press temperature than fluidities of the first substrate and the second substrate, and a plurality of substrates including the first substrate and the second substrate are laminated and thermally compressed and bonded at the press temperature.
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公开(公告)号:US20190159347A1
公开(公告)日:2019-05-23
申请号:US16257148
申请日:2019-01-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Shingo ITO , Kanto IIDA , Naoki GOUCHI
Abstract: A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.
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公开(公告)号:US20180309182A1
公开(公告)日:2018-10-25
申请号:US16022761
申请日:2018-06-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kanto IIDA , Nobuo IKEMOTO
IPC: H01P3/08
Abstract: A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.
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