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公开(公告)号:US20230050989A1
公开(公告)日:2023-02-16
申请号:US17979034
申请日:2022-11-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Nobuo IKEMOTO , Kanto IIDA
Abstract: A signal transmission line includes first and second base materials, and conductive bonding materials. The first base material includes a signal conductor. The second base material includes a ground conductor. The conductive bonding materials bond the first base and second base material to provide a gap. The first base material includes a mounting conductor to which the conductive bonding materials are respectively bonded. The mounting conductor includes a portion extending in parallel or substantially in parallel with the signal conductor on a side of a first side surface, and a portion extending in parallel or substantially in parallel with the signal conductor on a side of a second side surface. A position of a portion of the mounting conductor on the side of the first side surface and a position of a portion of the mounting conductor on the side of the second side surface are different from each other in a signal transmission direction.
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公开(公告)号:US20220131250A1
公开(公告)日:2022-04-28
申请号:US17568865
申请日:2022-01-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kanto IIDA , Nobuo IKEMOTO
Abstract: A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.
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公开(公告)号:US20200235451A1
公开(公告)日:2020-07-23
申请号:US16843979
申请日:2020-04-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kanto IIDA , Nobuo IKEMOTO
Abstract: A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.
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公开(公告)号:US20200258828A1
公开(公告)日:2020-08-13
申请号:US16861731
申请日:2020-04-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kanto IIDA , Hiromasa KOYAMA
IPC: H01L23/498
Abstract: An interposer includes a stacked body including insulating base material layers that are stacked on one another, first and second electrodes, a conductor pattern, and an interlayer connection conductor. The stacked body includes a first mounting surface including a first electrode, and a second mounting surface facing the first mounting surface and including a second electrode. The first electrode is electrically connected to the second electrode through the conductor pattern and the interlayer connection conductor. A length of an electrical path including conductor patterns connecting the first electrode and the second electrode is larger than a total length of the interlayer connection conductor in a stacking direction.
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公开(公告)号:US20190157001A1
公开(公告)日:2019-05-23
申请号:US16257156
申请日:2019-01-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kanto IIDA , Naoki GOUCHI , Shingo ITO
Abstract: A method for manufacturing a multilayer coil includes preparing a first substrate by forming a first conductor pattern on a first insulating base material layer, preparing a second substrate by forming a second conductor pattern on a second insulating base material layer, and joining a surface of the first substrate on which the first conductor pattern is formed and a surface of the second substrate on which the second conductor pattern is formed together with only a joining layer made of a thermoplastic resin interposed therebetween. Amounts of deformation of the first and second insulating base material layers are less than that of the joining layer at a fusion temperature. The first and second conductor patterns are each a coil pattern having a coil axis that extends in a lamination direction in which the first substrate and the second substrate are laminated together.
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公开(公告)号:US20180368252A1
公开(公告)日:2018-12-20
申请号:US16109918
申请日:2018-08-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Shinya OGURI , Wataru TAMURA , Kanto IIDA , Kuniaki YOSUI , Isamu MORITA
Abstract: An electronic device includes a transmission line and a circuit board. The transmission line includes a signal conductor, a base material, a first external connection conductor, a second external connection conductor, and a ground conductor, and defines a stripline. The circuit board includes a first mounting land conductor, a second mounting land conductor, and a radiation reduction conductor. The first mounting land conductor and the second mounting land conductor are provided in a concave portion on the surface of the circuit board, and are respectively connected to the first external connection conductor and the second external connection conductor. The radiation reduction conductor is provided on the lateral surface of the concave portion in which the transmission line is disposed, and is in contact with or adjacent to the first lateral surface and the second lateral surface of the base material.
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7.
公开(公告)号:US20140184359A1
公开(公告)日:2014-07-03
申请号:US14196269
申请日:2014-03-04
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor: Kanto IIDA , Yoichi SAITO , Satoshi SASAKI , Noboru KATO
IPC: H01P3/08
CPC classification number: H01P3/082 , H05K1/0225 , H05K1/025 , H05K1/0271 , H05K1/028 , H05K1/115 , H05K1/162 , H05K2201/09709 , H05K2201/09727 , H05K2201/09845
Abstract: A high-frequency signal transmission line includes a flexible body including a plurality of insulating layers. A linear signal line is located in or on the body. A first ground conductor is located opposite to the signal line via at least one of the insulating layers. A second ground conductor extends along the signal line. An interlayer connection portion that connects the first ground conductor and the second ground conductor includes a plurality of interlayer connection conductors individually pierced in some of the insulating layers and connected to each other. The plurality of interlayer connection conductors includes two interlayer connection conductors that are pierced in adjacent ones of the insulating layers with respect to a layer-stacking direction and that have central axes located in different positions when viewed from the layer-stacking direction.
Abstract translation: 高频信号传输线包括具有多个绝缘层的柔性主体。 线性信号线位于身体中或身上。 第一接地导体经由至少一个绝缘层位于与信号线相对的位置。 第二个接地导体沿信号线延伸。 连接第一接地导体和第二接地导体的层间连接部分包括在一些绝缘层中分别刺穿并彼此连接的多个层间连接导体。 多个层间连接导体包括两层层间连接导体,其相对于层堆叠方向在相邻的绝缘层中被刺穿,并且当从层堆叠方向观察时具有位于不同位置的中心轴。
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8.
公开(公告)号:US20140176254A1
公开(公告)日:2014-06-26
申请号:US14191595
申请日:2014-02-27
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor: Kanto IIDA , Shigeru TAGO
CPC classification number: H01P3/08 , H03H7/38 , H05K1/0225 , H05K1/0253 , H05K2201/09327 , H05K2201/09618 , H05K2201/09672 , H05K2201/09727
Abstract: A high-frequency signal transmission line includes a dielectric body including a plurality of dielectric sheets. A signal line is provided in the dielectric body. A connector is mounted on a first main surface of the dielectric body and electrically connected to the signal line. A ground conductor is provided on a second main surface side of the dielectric body, compared with the signal line, and faces the signal line across the dielectric sheet. In the ground conductor, conductor-missing portions are provided in which no conductors are provided in at least portions of regions overlapping with the signal line in planar in connection portions. Adjustment conductors are provided in the second main surface of the dielectric body, and overlap with at least portions of the conductor-missing portions in the planar view.
Abstract translation: 高频信号传输线包括包括多个电介质片的电介体。 信号线设置在电介质体中。 连接器安装在电介质体的第一主表面上并电连接到信号线。 与信号线相比,在电介质体的第二主表面侧设置接地导体,并且面对跨越电介质片的信号线。 在接地导体中,提供导体缺失部分,其中在与连接部分中平面的信号线重叠的区域的至少部分中不设置导体。 调整导体设置在电介质体的第二主表面中,并且在俯视图中与导体缺失部分的至少一部分重叠。
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公开(公告)号:US20230022402A1
公开(公告)日:2023-01-26
申请号:US17959333
申请日:2022-10-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Nobuo IKEMOTO , Kanto IIDA
Abstract: A signal transmission line includes a signal region that includes a signal conductor layer and insulating base material layers, and a first ground region that includes a first ground conductor layer and insulating base material layers and is located above the signal region. The signal region is not fixed to the first ground region in a first section of a base. One or more first spacers are fixed to the signal region and in contact with the first ground region without being fixed thereto, or are in contact with the signal region without being fixed thereto and fixed to the first ground region. The one or more first spacers are in the first section.
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公开(公告)号:US20190352565A1
公开(公告)日:2019-11-21
申请号:US16431908
申请日:2019-06-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Yoshimasa NISHI , Sunao FUKUTAKE , Akira MORIYA , Kanto IIDA
Abstract: A black liquid-crystal polymer film that contains a black pigment and a liquid crystal polymer and the black liquid-crystal polymer film has a lightness of 45 or less, a dielectric loss tangent of 0.0035 or less, a minimum dielectric breakdown strength of 60 kV/mm or more, and a maximum-to-minimum ratio of in-plane thermal linear expansion coefficient in the range of 1.0 to 2.5.
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