公开(公告)号：US20130250474A1

公开(公告)日：2013-09-26

申请号：US13899697

申请日：2013-05-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Syunsuke TAKEUCHI ,  Yoji YAMAMOTO ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Masahito SARUBAN

IPC: H01G4/30

CPC classification number: H01G4/30 ,  H01G4/01 ,  H01G4/228

Abstract: An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 μm or more.

Abstract translation: 电子部件包括彼此层叠的多个绝缘层的层叠体。 电容器导体嵌入层压体中，并且包括暴露在层压体的预定表面处的绝缘层之间的暴露部分。 外部电极通过直接电镀设置在预定表面上，以覆盖露出部分。 外部电极的外边缘与暴露部分间隔约0.8μm或更大。