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公开(公告)号:US11961673B2
公开(公告)日:2024-04-16
申请号:US18133153
申请日:2023-04-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hwi Dae Kim , Ji Hong Jo , Woo Chul Shin , Sang Soo Park , Chan Yoon
CPC classification number: H01G4/01 , H01G4/1227
Abstract: A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminatedly disposed in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.
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公开(公告)号:US11869718B2
公开(公告)日:2024-01-09
申请号:US17552786
申请日:2021-12-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Gi Sub Lee , Ah Young Lee , Chung Hyeon Ryu
Abstract: A multilayer capacitor includes a capacitor body having first to sixth surfaces, including a plurality of first and second dielectric layers and a plurality of internal electrodes stacked; and first and second external electrodes. The internal electrode includes first and second internal electrodes, a first floating electrode disposed between the first and second internal electrodes on the first dielectric layer, and second and third floating electrodes disposed on the second dielectric layer. The second floating electrode overlaps a portion of the first internal electrode and a portion of the first floating electrode, and the third floating electrode overlaps a portion of the second internal electrode and a portion of the first floating electrode. a/L is 0.113 or more, in which L is a length of the capacitor body, and a is a distance between the first floating electrode and the first or second internal electrodes.
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3.
公开(公告)号:US20230260697A1
公开(公告)日:2023-08-17
申请号:US18012126
申请日:2020-12-24
Applicant: TDK Corporation
Inventor: Yuki YAMASHITA , Kenichi YOSHIDA , Yoshihiko YANO , Daiki ISHII
Abstract: To provide a thin film capacitor in which a pair of terminal electrodes can be disposed on the same plane. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the metal foil is surface-roughened, a larger capacitance can be obtained.
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公开(公告)号:US11670451B2
公开(公告)日:2023-06-06
申请号:US17675313
申请日:2022-02-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hwi Dae Kim , Ji Hong Jo , Woo Chul Shin , Sang Soo Park , Chan Yoon
CPC classification number: H01G4/01 , H01G4/1227
Abstract: A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminated in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.
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公开(公告)号:US20190237251A1
公开(公告)日:2019-08-01
申请号:US16104570
申请日:2018-08-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chang Soo JANG , Ho Phil JUNG , Seung Mo LIM , Tae Joon PARK
CPC classification number: H01G4/01 , H01G4/008 , H01G4/1209 , H01G4/252
Abstract: A capacitor component includes: a semiconductor substrate including first and second portions, a trench penetrating through the substrate from one surface of the substrate to the other surface of the substrate to separate the first and second portions of the substrate from each other, a dielectric layer disposed in the trench and on the one surface of the substrate; a first pad electrode and a second pad electrode spaced apart from each other, and penetrating through the dielectric layer to be in contact with the first and second portions of the substrate, respectively, and a passivation layer disposed on the dielectric layer, covering portions of the first pad electrode and the second pad electrode, and exposing at least a portion of each of the first pad electrode and the second pad electrode.
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6.
公开(公告)号:US20180366174A1
公开(公告)日:2018-12-20
申请号:US15942599
申请日:2018-04-02
Applicant: NuStorage Technology Co., Ltd.
Inventor: FU-CHOU LIU
IPC: G11C11/22 , H01L27/108 , H01G4/01 , H01G4/08
CPC classification number: G11C11/221 , G11C11/2257 , G11C11/2273 , G11C11/2275 , H01G4/01 , H01G4/08 , H01L27/10852
Abstract: A selected ferroelectric memory cell of a ferroelectric memory is electrically connected to a first bit line, a second bit line, a first word line, a second word line and a plate line. The selected ferroelectric memory cell includes a first field effect transistor (“FET”), a second FET and a ferroelectric capacitor. A control terminal and a first access terminal of the first FET are electrically connected to the first word line and the first bit line, respectively. A control terminal and a first access terminal of the second FET are electrically connected to the second word line and the second bit line, respectively. A second access terminal of the first FET is electrically connected to a first capacitor electrode of the ferroelectric capacitor and a second terminal of the second FET. A second capacitor electrode of the ferroelectric capacitor is electrically connected to the plate line.
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公开(公告)号:US20180247766A1
公开(公告)日:2018-08-30
申请号:US15904804
申请日:2018-02-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Masaki FUKUDA , Yuji FUKADA , Jinya FURUI , Takashi INOUE , Takashi YAMAMOTO
CPC classification number: H01G2/065 , H01C1/142 , H01C1/144 , H01C7/003 , H01C7/008 , H01C17/283 , H01G4/008 , H01G4/01 , H01G4/1218 , H01G4/1227 , H01G4/1272 , H01G4/224 , H01G4/228 , H01G4/236 , H01G4/248
Abstract: A surface mount electronic component includes an element including a dielectric layer that includes a first main surface and a second main surface, a first external electrode disposed on the first main surface, a second external electrode disposed on the second main surface, a first metal terminal connected to the first external electrode, a second metal terminal connected to the second external electrode, and an exterior material covering at least a portion of the element, the first and second external electrodes, and the first and second metal terminals. Upper and lower surfaces of the exterior material are flat or substantially flat.
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公开(公告)号:US20180158616A1
公开(公告)日:2018-06-07
申请号:US15368171
申请日:2016-12-02
Applicant: Capacitor Sciences Incorporated
Inventor: Pavel Ivan Lazarev , Paul T. Furuta , Barry K. Sharp , Yan Li
IPC: H01G4/32 , H01G4/33 , H01G4/12 , H01G4/14 , H01G4/008 , H01G4/01 , C09D5/24 , C09D179/02 , C09D165/00
CPC classification number: H01G4/32 , C08G73/0266 , C08G73/0672 , C08G2261/3142 , C08G2261/3221 , C08G2261/3223 , C08G2261/3241 , C08G2261/3422 , C08G2261/51 , C09D5/24 , C09D165/00 , H01B1/127 , H01B1/128 , H01G4/008 , H01G4/01 , H01G4/14 , H01G4/33
Abstract: The present disclosure provides a multilayered electrode comprising an electro-conductive layer and at least one protective layer located on one side of the electro-conductive layer and selected from the list comprising a field-planarization layer, a tunneling injection blocking layer and a coulomb blocking layer.
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公开(公告)号:US09928960B2
公开(公告)日:2018-03-27
申请号:US14744123
申请日:2015-06-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Toru Nakanishi , Toshihiro Okamatsu , Akihiro Tsuru , Hiroyuki Wada
CPC classification number: H01G4/30 , C04B35/4682 , C04B2235/3206 , C04B2235/3224 , C04B2235/3225 , C04B2235/3244 , C04B2235/3262 , C04B2235/3418 , C04B2235/79 , H01G4/0085 , H01G4/01 , H01G4/1227 , H01G4/1245 , H01G4/224
Abstract: A monolithic ceramic capacitor that contains a perovskite compound including Ba and Ti and at least one type of element selected from Gd, Tb, and Dy, and contains elements selected from Y, Si, Mn, Mg, and Zr. The content a of at least one element selected from Gd, Tb, and Dy satisfies 0.2≤a≤0.8, the content b of Y satisfies 0.0≤b≤0.5, the content c of Si satisfies 0.0≤c≤2.5, the content d of Mn satisfies 0.0≤d≤0.25, the content e of Mg satisfies 0.0≤e≤1.2, the content f of Zr satisfies 0.0≤f≤0.5, and the molar ratio m of the content of Ba/(f+the content of Ti) satisfies 0.99≤m≤1.01, where the total content of Ti is 100 parts by mole.
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公开(公告)号:US09805867B2
公开(公告)日:2017-10-31
申请号:US13957342
申请日:2013-08-01
Applicant: Apple Inc.
Inventor: Shawn X. Arnold , Jeffrey M. Thoma , Connor R. Duke , Yanchu Xu , Nelson J. Kottke
IPC: H01G4/005 , H01G4/01 , H05K1/18 , H05K13/04 , B23K26/22 , H05K3/34 , H01G4/40 , H01G2/06 , H01G2/10 , H01G4/224 , H01G4/228
CPC classification number: H01G4/01 , B23K26/22 , H01G2/06 , H01G2/10 , H01G4/224 , H01G4/228 , H01G4/40 , H05K1/181 , H05K3/3442 , H05K13/0465 , H05K2201/10015 , H05K2201/10636 , H05K2201/10962 , H05K2201/2045 , Y02P70/611 , Y02P70/613
Abstract: The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.
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