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公开(公告)号:US20240214025A1
公开(公告)日:2024-06-27
申请号:US18537837
申请日:2023-12-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Shigeru TSUCHIDA , Kyohei MORITA , Yoshito MATSUMURA , Hiroki SHOUNAI , Ken NANKOU
IPC: H04B1/40
CPC classification number: H04B1/40
Abstract: A radio frequency module includes a module substrate having main surfaces that are opposite to each other, a plurality of external connection terminals that are disposed on the main surface, power amplifier circuits that are disposed on the main surface, a transformer that is connected to the power amplifier circuit and disposed on the main surface, and a transformer that is connected to the power amplifier circuit and disposed on the main surface. The power amplifier circuit is a Doherty-type power amplifier circuit, and the power amplifier circuit is a differential-amplifier-type power amplifier circuit.
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公开(公告)号:US20240214024A1
公开(公告)日:2024-06-27
申请号:US18499378
申请日:2023-11-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Shigeru TSUCHIDA , Kyohei MORITA , Yoshito MATSUMURA , Hiroki SHOUNAI , Ken NANKOU
IPC: H04B1/40
CPC classification number: H04B1/40
Abstract: A radio frequency module includes a module substrate having main surfaces that are opposite to each other, a plurality of external connection terminals that are disposed on the main surface, a power amplifier circuit that is disposed on the main surface and supports a first power class, a power amplifier circuit that is disposed on the main surface and supports a second power class, a transformer that is connected to the power amplifier circuit and disposed on the main surface, and a transformer that is connected to the power amplifier circuit and disposed on the main surface. The second power class is defined by a maximum output power higher than a third power class. The first power class is defined by a maximum output power lower than the second power class or the same maximum output power as the second power class.
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公开(公告)号:US20230361733A1
公开(公告)日:2023-11-09
申请号:US18349997
申请日:2023-07-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Morio TAKEUCHI , Shigeru TSUCHIDA , Yukiya YAMAGUCHI
CPC classification number: H03F3/245 , H03F1/56 , H04L5/14 , H04B1/40 , H03F2200/387 , H03F2200/451 , H03F2200/222
Abstract: A radio-frequency module includes a first power amplifier, a second power amplifier, a switch, a plurality of first filters, and a second filter. The first power amplifier amplifies a transmission signal of a first frequency band and outputs the amplified transmission signal. The second power amplifier amplifies a transmission signal of a second frequency band and outputs the amplified transmission signal. The pass bands of the plurality of first filters are contained within the first frequency band. The pass band of the second filter is contained within the second frequency band. The second power amplifier has a greater output power level than the first power amplifier. The first output terminal of the first power amplifier is switchably connectable to the plurality of first filters via the switch. The second output terminal of the second power amplifier is connected to the second filter without the switch interposed therebetween.
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公开(公告)号:US20220021407A1
公开(公告)日:2022-01-20
申请号:US17376167
申请日:2021-07-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Shigeru TSUCHIDA , Hiroki SHONAI , Masakazu TANI , Yukiya YAMAGUCHI , Morio TAKEUCHI
Abstract: A radio-frequency module includes a mounting substrate having a first main surface; a first power amplifier that is mounted on the first main surface and that amplifies a first transmission signal in a first frequency band; a second power amplifier that is mounted on the first main surface and that amplifies a second transmission signal in a second frequency band different from the first frequency band; a first output matching circuit that is mounted on the first main surface and that receives the first transmission signal amplified by the first power amplifier; and a second output matching circuit that is mounted on the first main surface and that receives the second transmission signal amplified by the second power amplifier. The first output matching circuit and the second output matching circuit are mounted along a second direction intersecting with the first direction.
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公开(公告)号:US20220021356A1
公开(公告)日:2022-01-20
申请号:US17341393
申请日:2021-06-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Yoshito MATSUMURA , Morio TAKEUCHI , Yukiya YAMAGUCHI , Shigeru TSUCHIDA , Hidetaka TAKAHASHI
Abstract: A radio-frequency module includes a mounting substrate and first and second power amplifiers. The first and second power amplifiers are each mounted on one main surface of the mounting substrate. The first power amplifier includes a first input terminal and a first outer periphery. The first outer periphery includes a first edge section. The second power amplifier includes a second input terminal and a second outer periphery. The second outer periphery includes a second edge section. The second edge section opposes the first edge section in a first direction. The first input terminal is disposed in the first edge section of the first power amplifier. The second input terminal is disposed in the second edge section of the second power amplifier. The first and second input terminals do not overlap each other in the first direction.
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16.
公开(公告)号:US20210021242A1
公开(公告)日:2021-01-21
申请号:US17064812
申请日:2020-10-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Shigeru TSUCHIDA
Abstract: A high frequency amplification circuit includes transmission amplification circuits 11 and 12; a transmission filter D-Tx whose pass band is a band D of a first frequency band group; transmission filters E-Tx and G-Tx whose pass bands are respectively bands E and G of a second frequency band group; an output matching circuit 31 configured to match the transmission amplification circuit 11 and the transmission filter D-Tx; and an output matching circuit 32 configured to match the transmission amplification circuit 12 and the transmission filters E-Tx and G-Tx. The band D is positioned at a high frequency-side end portion of the first frequency band group, and the band E is positioned at a low frequency-side end portion of the second frequency band group. The output matching circuit 31 includes a low-pass circuit, and the output matching circuit 32 includes an impedance-variable circuit.
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