公开(公告)号：US20240333238A1

公开(公告)日：2024-10-03

申请号：US18639997

申请日：2024-04-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kyohei MORITA

IPC: H03F3/24 ,  H01F19/04 ,  H01F27/29 ,  H03F1/56 ,  H03H7/42

CPC classification number: H03F3/245 ,  H01F19/04 ,  H01F27/292 ,  H03F1/565 ,  H03H7/42 ,  H03F2200/318 ,  H03F2200/451

Abstract: A transformer that can increase a coupling coefficient of the transformer by suppressing a signal loss in the transformer. The transformer includes a balanced side coil, an unbalanced side coil, a wiring pattern portion, and a multilayer substrate. The balanced side coil has a first end, a second end, and an intermediate tap. The unbalanced side coil has a third end. The wiring pattern portion is electrically connected to the intermediate tap. The multilayer substrate has a plurality of dielectric layers, and the balanced side coil, the unbalanced side coil, and the wiring pattern portion are disposed on dielectric layers different from each other in the plurality of dielectric layers. The balanced side coil and the unbalanced side coil overlap each other in a plan view from a thickness direction of the multilayer substrate.

公开(公告)号：US20240214025A1

公开(公告)日：2024-06-27

申请号：US18537837

申请日：2023-12-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru TSUCHIDA ,  Kyohei MORITA ,  Yoshito MATSUMURA ,  Hiroki SHOUNAI ,  Ken NANKOU

IPC: H04B1/40

CPC classification number: H04B1/40

Abstract: A radio frequency module includes a module substrate having main surfaces that are opposite to each other, a plurality of external connection terminals that are disposed on the main surface, power amplifier circuits that are disposed on the main surface, a transformer that is connected to the power amplifier circuit and disposed on the main surface, and a transformer that is connected to the power amplifier circuit and disposed on the main surface. The power amplifier circuit is a Doherty-type power amplifier circuit, and the power amplifier circuit is a differential-amplifier-type power amplifier circuit.

公开(公告)号：US20240214024A1

公开(公告)日：2024-06-27

申请号：US18499378

申请日：2023-11-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru TSUCHIDA ,  Kyohei MORITA ,  Yoshito MATSUMURA ,  Hiroki SHOUNAI ,  Ken NANKOU

IPC: H04B1/40

CPC classification number: H04B1/40

Abstract: A radio frequency module includes a module substrate having main surfaces that are opposite to each other, a plurality of external connection terminals that are disposed on the main surface, a power amplifier circuit that is disposed on the main surface and supports a first power class, a power amplifier circuit that is disposed on the main surface and supports a second power class, a transformer that is connected to the power amplifier circuit and disposed on the main surface, and a transformer that is connected to the power amplifier circuit and disposed on the main surface. The second power class is defined by a maximum output power higher than a third power class. The first power class is defined by a maximum output power lower than the second power class or the same maximum output power as the second power class.

公开(公告)号：US20230328877A1

公开(公告)日：2023-10-12

申请号：US18155995

申请日：2023-01-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukiya YAMAGUCHI ,  Takanori UEJIMA ,  Yuji TAKEMATSU ,  Dai NAKAGAWA ,  Kyohei MORITA

IPC: H05K1/18 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K1/0271 ,  H05K1/0225 ,  H05K1/185 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2203/025

Abstract: The high frequency module includes a mounting substrate, a circuit component, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The circuit component is mounted on the first main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate and covers at least part of an outer peripheral surface of the circuit component. The shield layer covers at least part of the resin layer and a main surface of the circuit component that is far from the mounting substrate. The high frequency module has a gap at at least one of a position between the circuit component and the resin layer, a position between the circuit component and the shield layer, a position inside the resin layer, and a position inside the shield layer.