公开(公告)号：US11757478B2

公开(公告)日：2023-09-12

申请号：US17955570

申请日：2022-09-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru Tsuchida ,  Daerok Oh ,  Takahiro Katamata ,  Satoshi Goto ,  Mitsunori Samata ,  Yoshiki Yasutomo

IPC: H04B1/04 ,  H03F1/56 ,  H03F3/24

CPC classification number: H04B1/04 ,  H03F1/56 ,  H03F3/245 ,  H03F2200/171 ,  H03F2200/222 ,  H03F2200/451 ,  H04B2001/0408

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.