公开(公告)号：US20200228073A1

公开(公告)日：2020-07-16

申请号：US16829477

申请日：2020-03-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke NANIWA

IPC: H03F3/19 ,  H03F1/56 ,  H04B1/40

Abstract: A radio-frequency module includes a substrate, a first circuit arranged on the substrate and includes a first amplifier for amplifying a diversity signal, and a second circuit arranged on the substrate and includes a second amplifier for amplifying a MIMO signal. The first amplifier and the second amplifier are formed on a single component and are arranged in a central portion in a plan view of the substrate. The first circuit and the second circuit may include a first matching element connected to the first amplifier and a second matching element connected to the second amplifier, respectively. The first amplifier and the second amplifier may be arranged in the central portion on a first main surface of the substrate. The first matching element and the second matching element may be arranged in the central portion on a second main surface of the substrate.

公开(公告)号：US20190296783A1

公开(公告)日：2019-09-26

申请号：US16435645

申请日：2019-06-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke NANIWA ,  Hideki MUTO

IPC: H04B1/12 ,  H04B1/10 ,  H04B1/16

Abstract: A radio frequency module includes a first receive circuit that processes a receive signal in the first frequency band. The first receive circuit includes a first substrate, a first low noise amplifier, and a first filter circuit. The first low noise amplifier is mounted on a principal surface of the first substrate. The first filter circuit is connected to an output end of the first low noise amplifier. At least a portion of the first filter circuit is provided on the principal surface of the first substrate. The first filter circuit attenuates spurious components occurring due to a transmit signal in the first frequency band received by the first low noise amplifier. The spurious components are included in the transmit signal in the first frequency band and have a frequency bandwidth that overlaps, includes, or is included in the frequency bandwidth of the receive signal in the second frequency band.

公开(公告)号：US20190238169A1

公开(公告)日：2019-08-01

申请号：US16377326

申请日：2019-04-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke NANIWA ,  Hideki MUTO

IPC: H04B1/10 ,  H04B1/38

CPC classification number: H04B1/1027 ,  H04B1/00 ,  H04B1/10 ,  H04B1/1018 ,  H04B1/38

Abstract: An RF module includes a switch IC on a surface of a module substrate and a passive circuit provided in and/or on the module substrate. The switch IC includes a high-frequency circuit on an IC substrate and a digital control circuit. In a plan view of the IC substrate, the digital control circuit is surrounded by the high-frequency circuit. The high-frequency circuit includes analog ground electrodes in a boundary portion with the digital control circuit in the high-frequency circuit to surround the digital control circuit in the plan view.